3D Orientation Determination DEMO
Résumé
The microelectronic department at LIRMM has developed, in the past few years, various types of MEMS sensors. The particularity of our group is to design MEMS that can be integrated either in a System on Chip (SoC) or in a System in Package (SiP) approaches. Therefore, the purpose of this demonstration is to show the feasibility of a silicon attitude sensor using 2 MEMS magnetometers, 2 MEMS thermal accelerometers and the appropriate electronic architecture. This paper also presents the attitude calculation algorithm developed for this demonstration.
Domaines
Electronique
Origine : Fichiers produits par l'(les) auteur(s)
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