Full Wave Analysis and Electrical Modeling of Eight Copper Interconnects Placed in a Giga-Scale Integrated Environment for Signal Integrity Evaluation

Abstract : Signal integrity analysis on eight unintentionally coupled copper interconnects is derived from an equivalent distributed electrical multi-conductor cell. Compatible with SPICE environment, this elementary cell is calculated with a full wave analysis such as tangential vector finite element method and the transmission line theory. After R, L, C, G and mutual extraction, two types of excitation are implemented based on one aggressor and seven victims and vice versa in order to weigh the influence of parasitic mutual via crosstalk evaluation.
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Communication dans un congrès
ESTC'06: Electronics Systemintegration Technology Conference, Sep 2006, Dresden (Germany), France. pp.747-751, 2006
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Soumis le : vendredi 15 septembre 2006 - 10:52:13
Dernière modification le : mardi 3 juillet 2018 - 11:31:58
Document(s) archivé(s) le : lundi 5 avril 2010 - 22:51:54

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  • HAL Id : lirmm-00094966, version 1

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Freddy Ponchel, Jean-François Legier, Erick Paleczny, Christophe Seguinot, Denis Deschacht. Full Wave Analysis and Electrical Modeling of Eight Copper Interconnects Placed in a Giga-Scale Integrated Environment for Signal Integrity Evaluation. ESTC'06: Electronics Systemintegration Technology Conference, Sep 2006, Dresden (Germany), France. pp.747-751, 2006. 〈lirmm-00094966〉

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