Interconnect Pitch for New Generation: Evolution due to Inductive Impact - LIRMM - Laboratoire d’Informatique, de Robotique et de Microélectronique de Montpellier
Conference Papers Year : 2006

Interconnect Pitch for New Generation: Evolution due to Inductive Impact

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lirmm-00102769 , version 1 (02-10-2006)

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  • HAL Id : lirmm-00102769 , version 1

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Jean-Etienne Lorival, Denis Deschacht, Yves Quéré, Thierry Le Gouguec, Fabrice Huret. Interconnect Pitch for New Generation: Evolution due to Inductive Impact. IEEE Workshop on Signal Propagation on Interconnects, May 2006, Berlin, Germany. pp.193-196. ⟨lirmm-00102769⟩
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