H. Takao, H. Fukumoto, and M. Ishida, A CMOS integrated three-axis accelerometer fabricated with commercial submicrometer CMOS technology and bulk-micromachining, IEEE Transactions on Electron Devices, vol.48, issue.9, 2000.
DOI : 10.1109/16.944183

A. Devices, ±5g to ±50g, Low Noise, Low Power, Single/Dual Axis iMEMS Accelerometer

J. M. Bustillo, R. T. Howe, and R. S. Muller, Surface micromachining for microelectromechanical systems, Proceedings of the IEEE, vol.86, issue.8, p.8, 1998.
DOI : 10.1109/5.704260

H. Xie and G. K. Fedder, A CMOS Z-axis capacitive Accelerometer with comb-finger sensing, IEEE MEMS, pp.496-501, 2002.

H. Luo, G. Fedder, and L. R. Carley, A 1mG Lateral CMOS-MEMS Accelerometer, The Thirteenth Annual International Conference on, pp.23-27, 2000.

L. Zimmerman, J. Ph, F. Ebersohl, J. P. Le-hung, F. Berry et al., Airbag application: a microsystem including a silicon capacitive accelerometer, CMOS switched capacitor electronics and true self-test capability, Sensors and Actuators A, pp.46-47, 1995.
DOI : 10.1016/0924-4247(94)00888-O

A. M. Leung, J. Jones, E. Czyzewska, J. Chen, and B. Woods, Micromachined Accelerometer Based on Convection Heat Transfer The Eleventh Annual International Workshop on, IEEE MEMS, pp.25-29, 1998.

M. Dardalhon, V. Beroulle, L. Latorre, P. Nouet, G. Perez et al., Reliability analysis of CMOS MEMS structures obtained by Front Side Bulk Micromachining, Microelectronics Reliability, vol.42, issue.9-11, pp.1777-1782, 2002.
DOI : 10.1016/S0026-2714(02)00230-5
URL : https://hal.archives-ouvertes.fr/lirmm-00268582

. Austria-mikro-systeme, 0,8 µm CMOS Process Parameters

K. R. Petersen, Silicon As Mechanical Material, Proc. of the IEEE, 1982.
DOI : 10.1109/proc.1982.12331
URL : http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.125.3152

T. B. Gabrielson, Mechanical-thermal noise in micromachined acoustic and vibration sensors, IEEE Transactions on Electron Devices, vol.40, issue.5, p.5, 1993.
DOI : 10.1109/16.210197

V. Beroulle, L. Latorre, and P. Nouet, Micromachined CMOS magnetic field sensors with low-noise signal conditioning, Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266), pp.256-259, 2002.
DOI : 10.1109/MEMSYS.2002.984251
URL : https://hal.archives-ouvertes.fr/lirmm-00268486

L. Latorre, V. Beroulle, M. Dardalhon, P. Nouet, F. Presseq et al., Characterization of CMOS MEMS Technology Scatterings, Proc. ISTFA 2001, pp.373-377, 2001.