Wireless Wafer Test for Iterative Testing During System Assembly - LIRMM - Laboratoire d’Informatique, de Robotique et de Microélectronique de Montpellier Access content directly
Conference Poster Year : 2010
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lirmm-00537849 , version 1 (19-11-2010)

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  • HAL Id : lirmm-00537849 , version 1

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Ziad Noun, Philippe Cauvet, Marie-Lise Flottes, David Andreu, Serge Bernard. Wireless Wafer Test for Iterative Testing During System Assembly. 3D-Test: Testing Three-Dimensional Stacked Integrated Circuits, Nov 2010, Austin, Texas, United States. , 1st IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits, 2010. ⟨lirmm-00537849⟩
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