Kernelization lower bounds by crosscomposition, SIAM J. Discrete Math, vol.28, issue.1, pp.277-305, 2014. ,
On the complexity of wafer-to-wafer integration, Discrete Optimization, vol.22, pp.255-269, 2016. ,
URL : https://hal.archives-ouvertes.fr/lirmm-01110027
Multidimensional binary vector assignment problem: Standard, structural and above guarantee parameterizations, Fundamentals of Computation Theory -20th International Symposium, pp.189-201, 2015. ,
URL : https://hal.archives-ouvertes.fr/lirmm-01889400
On multiway cut parameterized above lower bounds, ACM Transactions on Computation Theory (TOCT), vol.5, issue.1, p.11, 2013. ,
Approximation algorithms for the wafer to wafer integration problem, Approximation and Online Algorithms -10th International Workshop, WAOA 2012, pp.286-297, 2012. ,
URL : https://hal.archives-ouvertes.fr/lirmm-00805063
Multi-dimensional vector assignment problems, Discrete Optimization, vol.14, pp.111-125, 2014. ,
Fundamentals of Parameterized Complexity. Texts in Computer Science, 2013. ,
New limits to classical and quantum instance compression, SIAM J. Comput, vol.44, issue.5, pp.1443-1479, 2015. ,
The linear arrangement problem parameterized above guaranteed value. Theory of Computing Systems, vol.41, pp.521-538, 2007. ,
The multivariate algorithmic revolution and beyond. chapter Constraint Satisfaction Problems Parameterized Above or Below Tight Bounds: A Survey, pp.257-286, 2012. ,
Which problems have strongly exponential complexity?, Journal of Computer and System Sciences, vol.63, pp.512-530, 2001. ,
Slightly superexponential parameterized problems, Proceedings of the Twenty-Second Annual ACM-SIAM Symposium on Discrete Algorithms, pp.760-776, 2011. ,
Lower bounds based on the exponential time hypothesis, Bulletin of EATCS, issue.3, 2013. ,
Faster parameterized algorithms using linear programming, ACM Transactions on Algorithms (TALG), vol.11, issue.2, p.15, 2014. ,
Parameterizing above or below guaranteed values, Journal of Computer and System Sciences, vol.75, issue.2, pp.137-153, 2009. ,
Maximizing the functional yield of wafer-to-wafer 3-d integration, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol.17, pp.1357-1362, 2009. ,