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Overview of Physical Design Issues for 3D-Integrated Circuits

Aida Todri-Sanial 1
1 SysMIC - Conception et Test de Systèmes MICroélectroniques
LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
Abstract : Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
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Contributor : Caroline Lebrun <>
Submitted on : Tuesday, January 24, 2017 - 2:43:50 PM
Last modification on : Wednesday, December 11, 2019 - 1:32:02 AM


  • HAL Id : lirmm-01444992, version 1


Aida Todri-Sanial. Overview of Physical Design Issues for 3D-Integrated Circuits. Aida Todri-Sanial; Chuan Seng Tan. Physical Design for 3D Integrated Circuits, CRC Press, pp.31-37, 2015, Chapter 2. PHYSICAL DESIGN METHODS FOR 3D INTEGRATION, 9781498710367. ⟨lirmm-01444992⟩



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