Fast modeling of core switching noise on distributed LRC power grid in ULSI circuits, IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524), pp.245-254, 2001. ,
DOI : 10.1109/EPEP.2000.895551
Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods, Proceedings of the IEEE, vol.94, issue.8, pp.1487-1501, 2006. ,
DOI : 10.1109/JPROC.2006.879797
A Study of Tapered 3-D TSVs for Power and Thermal Integrity, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol.21, issue.2, pp.306-319, 2013. ,
DOI : 10.1109/TVLSI.2012.2187081
URL : https://hal.archives-ouvertes.fr/lirmm-00806776
Performance Modeling for Single- and Multiwall Carbon Nanotubes as Signal and Power Interconnects in Gigascale Systems, IEEE Transactions on Electron Devices, vol.55, issue.10, pp.2574-2582, 2008. ,
DOI : 10.1109/TED.2008.2003028
Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status, and Prospects, IEEE Transactions on Electron Devices, vol.56, issue.9, pp.1799-1821, 2009. ,
DOI : 10.1109/TED.2009.2026524
Circuit Models of Carbon-Based Interconnects for Nanopackaging, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.3, issue.11, pp.1926-1937, 2013. ,
DOI : 10.1109/TCPMT.2013.2262213
The feasibility of Carbon Nanotubes for power delivery in 3-D Integrated Circuits, 17th Asia and South Pacific Design Automation Conference, pp.1-3, 2012. ,
DOI : 10.1109/ASPDAC.2012.6165010
Investigation of horizontally aligned carbon nanotubes for efficient power delivery in 3D ICs, Proc. of IEEE 18th Workshop on Signal and Power Integrity (SPI), 2014. ,
Thermal conductivity of multiwalled carbon nanotubes, Thermal conductivity of multiwalled carbon nanotubes, p.165440, 2002. ,
DOI : 10.1103/PhysRevB.66.165440
Layer and size dependence of thermal conductivity in multilayer graphene nanoribbons, Physics Letters A, vol.376, issue.4, pp.525-528, 2012. ,
DOI : 10.1016/j.physleta.2011.11.016
High-temperature quenching of electrical resistance in graphene interconnects, Applied Physics Letters, vol.92, issue.20, p.202108, 2008. ,
DOI : 10.1063/1.2927371
Size-Dependent Effects on the Temperature Coefficient of Resistance of Carbon Nanotube Vias, IEEE Transactions on Electron Devices, vol.60, issue.12, pp.4085-4089, 2013. ,
DOI : 10.1109/TED.2013.2287640
A node clustering reduction scheme for power grids electrothermal analysis, 2015 IEEE 19th Workshop on Signal and Power Integrity (SPI), 2015. ,
DOI : 10.1109/SaPIW.2015.7237399
URL : https://hal.archives-ouvertes.fr/lirmm-01248589
Current source modeling for power and timing analysis at different supply voltages, 2012 Design, Automation & Test in Europe Conference & Exhibition (DATE), pp.923-928, 2012. ,
DOI : 10.1109/DATE.2012.6176629
Temperature effects on electrical performance of carbon-based nano-interconnects at chip and package level, International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, vol.97, issue.1, pp.560-572, 2013. ,
DOI : 10.1002/jnm.1884