Influence of sruface and grain-boundary scattering on the resisitvity, Appl. Phys. Lett, vol.84, issue.15, pp.2838-2840, 2004. ,
Comprehensive study of the resistivity of copper wires with lateral dimensions of 100 nm and smaller, J. Appl. Phys, vol.97, p.23706, 2005. ,
Electromigration Reliability Issues in Dual-Damascene Cu Interconnections, IEEE Trans. Rel, vol.51, issue.4, pp.403-419, 2002. ,
, International Technology Roadmap for Semiconductors
One hundred fold increase in current carrying capacity in a carbon nanotube-copper composite, Nat.Commun, vol.4, p.2202, 2013. ,
, Carbon Nanotube Interconnects: Process, Design and Applications, 2016.
A Survey of Carbon Nanotube Interconnects for Energy Efficient Integrated Circuits, IEEE Circuits and Systems Magazine, vol.17, pp.47-62, 2017.,
URL : https://hal.archives-ouvertes.fr/lirmm-01795757
Compact Physical Models for Multiwall Carbon-Nanotube Interconnects, IEEE Electron Device Lett, vol.27, issue.5, pp.338-340, 2006. ,
Circuit modeling and performance analysis of multi-walled carbon nanotube interconnects, IEEE Trans. on Electron Devices, vol.55, issue.6, pp.1328-1337, 2008. ,
, Atomistix Tool Kit, 2016.
Quantum Effects on the Capacitance of Graphene-Based Electrodes, J. Phys. Chem, vol.119, issue.39, pp.22297-22303, 2015. ,
, The dependence of the delay ratio of MWCNT interconnects with = a) 10 nm, b) 14 nm, and c) 22 nm on the interconnect length and the number of conducting channel per shell