Carbon nanotubes for Interconnects: Process, Design and Applications

Abstract : This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
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Contributor : Aida Todri-Sanial <>
Submitted on : Monday, September 24, 2018 - 12:52:18 PM
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Aida Todri-Sanial, Jean Dijon, Antonio Maffucci. Carbon nanotubes for Interconnects: Process, Design and Applications. Springer, 2017, 978-3-319-29746-0. ⟨10.1007/978-3-319-29746-0⟩. ⟨lirmm-01879918⟩



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