Electromagnetic Fault Injection (EMFI) has recently gained popularity as a mean to induce faults because of its inherent advantages. Among them, the most interesting is probably its ability to generate faults in Systems on Chips without removing the package, and this even if only the frontside is exposed to the EM field. Despite this popularity, there is only little information on how EMFI generates faults. Within this context, this paper first aims at filling this lack by proposing a complete modeling of EM induction fault mechanism. In a second step, the introduced model is confronted to experimental data in order to demonstrate its soundness.