A. Todri-sanial and C. Tan, Physical Design for 3D Integrated Circuit, p.9781498710367, 2015.

A. Todri, Overview of Physical Design Issues for 3D ICs," book chapter in Physical Design for 3D ICs, p.9781498710367, 2015.

A. Todri, Design Methodology for 3D Power Delivery Networks," book chapter in Physical Design for 3D ICs, p.9781498710367, 2015.

Y. Zhao, J. Yang, W. Zhao, A. Todri-sanial, and Y. Cheng, Power Supply Noise Aware Task Scheduling on Homogeneous 3D MPSoCs Considering the Thermal Constraint, Journal of Computer Science and Technology, vol.33, issue.5, pp.1-17, 2018.
URL : https://hal.archives-ouvertes.fr/lirmm-01879928

A. Todri-sanial and Y. Cheng, A Study of 3-D Power Delivery Networks with Multiple Clock Domains, IEEE Transactions on Very Large-Scale Integration (VLSI) Systems, vol.24, pp.3218-3231, 2016.
URL : https://hal.archives-ouvertes.fr/lirmm-01446137

Y. Cheng, A. Todri-sanial, J. Yang, and W. Zhao, Alleviating Through-Silicon-Via Electromigration for 3-D Integrated Circuits Taking Advantage of Self-Healing Effect, IEEE Transactions on Very Large-Scale Integration (VLSI) Systems, vol.24, pp.3310-3322, 2016.
URL : https://hal.archives-ouvertes.fr/lirmm-01446125

A. Todri-sanial, S. Kundu, P. Girard, A. Bosio, L. Dilillo et al., Globally Constrained Locally Optimized 3-D Power Delivery Networks, IEEE Transactions on Very Large-Scale Integration (VLSI) Systems, vol.22, pp.2131-2144, 2014.
URL : https://hal.archives-ouvertes.fr/lirmm-01255754

A. Todri, A. Bosio, L. Dilillo, P. Girard, S. Pravossoudovitch et al., Uncorrelated Power Supply Noise and Ground Bounce Consideration for Pattern Generation, IEEE Transactions on Very Large-Scale Integration (VLSI) Systems, vol.21, pp.958-970, 2013.
URL : https://hal.archives-ouvertes.fr/lirmm-00806774

A. Todri, S. Kundu, P. Girard, A. Bosio, L. Dilillo et al., A Study of Tapered 3D TSVs for Power and Thermal Integrity, IEEE Transactions on Very Large-Scale Integration (VLSI) Systems, vol.21, pp.306-319, 2013.
URL : https://hal.archives-ouvertes.fr/lirmm-00806776

A. Todri and M. Marek-sadowska, Reliability Analysis and Optimization for Power Gated ICs with Multiple Power Gating Configurations, IEEE Transactions on Very Large-Scale Integration Systems, vol.19, pp.457-468, 2011.

A. Todri and M. Marek-sadowska, Power Delivery for Multi-Core Systems, IEEE Transactions on Very Large-Scale Integration Systems, vol.19, pp.2243-2255, 2011.

A. Koneru, A. Todri-sanial, and K. Chakrabarty, Reliable Power Delivery and Analysis of Power-Supply Noise During Testing in Monolithic 3D ICs, 2019 IEEE 37th VLSI Test Symposium (VTS), pp.1-6, 2019.
URL : https://hal.archives-ouvertes.fr/lirmm-02131987

A. Koneru, A. Todri-sanial, and K. Chakrabarty, Power-Supply Noise Analysis for Monolithic 3D ICs Using Electrical and Thermal Co-Simulation, 25th IEEE International Conference on Electronics, Circuits and Systems (ICECS), pp.217-220, 2018.
URL : https://hal.archives-ouvertes.fr/lirmm-01880158