Carbon nanotubes for Interconnects: Process, Design and Applications, pp.978-981, 2017. ,
URL : https://hal.archives-ouvertes.fr/lirmm-01444977
Exploring Carbon Nanotubes for 3D Power Delivery," book chapter, Carbon nanotube Interconnect: Process, Design, and Applications, pp.978-981, 2017. ,
Investigation of Pt-Salt Doped Stand-Alone Multi-Wall Carbon Nanotubes for On-Chip Interconnect Applications, IEEE Transactions on Electron Devices ,
Variability Study of MWCNT Local Interconnects Considering Defects and Contact Resistances -Part I: Pristine MWCNT, IEEE Transactions on Electron Devices, 2018. ,
URL : https://hal.archives-ouvertes.fr/lirmm-01879935
Variability Study of MWCNT Local Interconnects Considering Defects and Contact Resistances -Part II: Impact of Charge Transfer Doping, IEEE Transactions on Electron Devices, 2018. ,
URL : https://hal.archives-ouvertes.fr/lirmm-01879940
Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electro-Thermal Simulation Study, IEEE Transactions on Electron Devices, vol.65, pp.3884-3892, 2018. ,
Atomistic to Circuit-Level Modeling of Doped SWCNT for On-Chip Interconnects, IEEE Transactions on Nanotechnology ,
URL : https://hal.archives-ouvertes.fr/lirmm-01795792
A Survey of Carbon Nanotube Interconnects for Energy Efficient Integrated Circuits, IEEE Circuits and Systems Magazine, vol.17, pp.47-62, 2017. ,
URL : https://hal.archives-ouvertes.fr/lirmm-01795757
Electrothermal Analysis of Carbon Nanotubes Power Delivery Networks for Nanoscale Integrated Circuits, IEEE Transactions on Nanotechnology, vol.15, issue.3, pp.380-388, 2016. ,
URL : https://hal.archives-ouvertes.fr/lirmm-01445865
Importance of Interconnects: A Technology-System Level Design Perspective, IEEE International Electron Devices Meeting (IEDM), 2019. ,
URL : https://hal.archives-ouvertes.fr/lirmm-02388007
Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects, IEEE International Interconnect Technology Conference (IITC), pp.16-18, 2018. ,
URL : https://hal.archives-ouvertes.fr/lirmm-01880138
, IEEE/ACM Design, Automation and Test in Europe Conference (DATE), 2018.
A Physics-Based Investigation of Pt-Salt Doped Carbon Nanotubes for Local Interconnects, IEEE International Electron Devices Meeting (IEDM), 2017. ,
URL : https://hal.archives-ouvertes.fr/lirmm-01795777
Atomistic to Circuit Level Modeling of Defective Doped SWCNTs with Contacts for On-Chip Interconnect Application, IEEE Nanotechnology Materials and Devices Conference (NMDC), 2017. ,
URL : https://hal.archives-ouvertes.fr/lirmm-01880220
Power and Performance Analysis of Doped SW/DW CNT for On-Chip Interconnect Application, GRAPHENE 2017 International Conference ,
URL : https://hal.archives-ouvertes.fr/lirmm-01800286
A hierarchical model for CNT and Cu-CNT composite interconnects: from density functional theory to circuitlevel simulations, IEEE International Workshop on Computational Nanotechnology, p.2017 ,
The impact of vacancy defects on CNT interconnects: From statistical atomistic study to circuit simulations, International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp.157-160, 2017. ,
URL : https://hal.archives-ouvertes.fr/lirmm-01795799
Atoms-to-circuits simulation investigation of CNT interconnects for next generation CMOS technology, International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp.153-156, 2017. ,
URL : https://hal.archives-ouvertes.fr/lirmm-01795803
Electrical performance of carbon-based power distribution networks with thermal effects, IEEE 21st Workshop on Signal and Power Integrity, pp.1-4, 2017. ,
URL : https://hal.archives-ouvertes.fr/lirmm-01795816
Physical description and analysis of doped carbon nanotube interconnects, International Workshop on Power and Timing Modeling, Optimization and Simulation (PATMOS), pp.250-255, 2016. ,
URL : https://hal.archives-ouvertes.fr/lirmm-01457338
Investigation of electrical and thermal properties of carbon nanotube interconnects, International Workshop on Power and Timing Modeling, Optimization and Simulation (PATMOS), pp.25-32, 2016. ,
URL : https://hal.archives-ouvertes.fr/lirmm-01457289
Present and future prospects of carbon nanotube interconnects for energy efficient integrated circuits, International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp.1-5, 2016. ,
URL : https://hal.archives-ouvertes.fr/lirmm-01446241