A. Todri-sanial, J. Dijon, and A. Maffuci, Carbon nanotubes for Interconnects: Process, Design and Applications, pp.978-981, 2017.
URL : https://hal.archives-ouvertes.fr/lirmm-01444977

A. Todri, Exploring Carbon Nanotubes for 3D Power Delivery," book chapter, Carbon nanotube Interconnect: Process, Design, and Applications, pp.978-981, 2017.

J. Liang, R. Chen, R. Ramos, J. Lee, H. Okuno et al., Investigation of Pt-Salt Doped Stand-Alone Multi-Wall Carbon Nanotubes for On-Chip Interconnect Applications, IEEE Transactions on Electron Devices

R. , C. J. Liang, J. Lee, V. P. Georgiev, R. Ramos et al., Variability Study of MWCNT Local Interconnects Considering Defects and Contact Resistances -Part I: Pristine MWCNT, IEEE Transactions on Electron Devices, 2018.
URL : https://hal.archives-ouvertes.fr/lirmm-01879935

R. , C. J. Liang, J. Lee, V. P. Georgiev, R. Ramos et al., Variability Study of MWCNT Local Interconnects Considering Defects and Contact Resistances -Part II: Impact of Charge Transfer Doping, IEEE Transactions on Electron Devices, 2018.
URL : https://hal.archives-ouvertes.fr/lirmm-01879940

J. Lee, S. Berrada, F. Adamu-lema, H. Carrillo-nunez, N. Nagy et al., Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electro-Thermal Simulation Study, IEEE Transactions on Electron Devices, vol.65, pp.3884-3892, 2018.

J. Liang, J. Lee, S. Berrada, V. Georgiev, R. R. Pandey et al., Atomistic to Circuit-Level Modeling of Doped SWCNT for On-Chip Interconnects, IEEE Transactions on Nanotechnology
URL : https://hal.archives-ouvertes.fr/lirmm-01795792

A. Todri-sanial, R. Ramos, H. Okuno, J. Dijon, A. Dhavamani et al., A Survey of Carbon Nanotube Interconnects for Energy Efficient Integrated Circuits, IEEE Circuits and Systems Magazine, vol.17, pp.47-62, 2017.
URL : https://hal.archives-ouvertes.fr/lirmm-01795757

A. Magnani, M. De-magistris, A. Todri-sanial, and A. Maffucci, Electrothermal Analysis of Carbon Nanotubes Power Delivery Networks for Nanoscale Integrated Circuits, IEEE Transactions on Nanotechnology, vol.15, issue.3, pp.380-388, 2016.
URL : https://hal.archives-ouvertes.fr/lirmm-01445865

J. Liang and A. Todri, Importance of Interconnects: A Technology-System Level Design Perspective, IEEE International Electron Devices Meeting (IEDM), 2019.
URL : https://hal.archives-ouvertes.fr/lirmm-02388007

B. Uhlig, A. Dhavamani, N. Nagy, R. Lilienthal, R. Liske et al., Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects, IEEE International Interconnect Technology Conference (IITC), pp.16-18, 2018.
URL : https://hal.archives-ouvertes.fr/lirmm-01880138

B. Uhlig, J. Liang, J. Lee, R. Ramos, A. Dhavamani et al., IEEE/ACM Design, Automation and Test in Europe Conference (DATE), 2018.

J. Liang, R. Ramos, J. Dijon, H. Okuno, D. Kalita et al., A Physics-Based Investigation of Pt-Salt Doped Carbon Nanotubes for Local Interconnects, IEEE International Electron Devices Meeting (IEDM), 2017.
URL : https://hal.archives-ouvertes.fr/lirmm-01795777

J. Liang, J. Lee, S. Berrada, V. Georgiev, A. Asenov et al., Atomistic to Circuit Level Modeling of Defective Doped SWCNTs with Contacts for On-Chip Interconnect Application, IEEE Nanotechnology Materials and Devices Conference (NMDC), 2017.
URL : https://hal.archives-ouvertes.fr/lirmm-01880220

J. Liang and A. Todri-sanial, Power and Performance Analysis of Doped SW/DW CNT for On-Chip Interconnect Application, GRAPHENE 2017 International Conference
URL : https://hal.archives-ouvertes.fr/lirmm-01800286

J. Lee, T. Sadi, J. Liang, V. P. Georgiev, A. Todri-sanial et al., A hierarchical model for CNT and Cu-CNT composite interconnects: from density functional theory to circuitlevel simulations, IEEE International Workshop on Computational Nanotechnology, p.2017

J. Lee, S. Berrada, J. Liang, T. Sadi, V. Georgiev et al., The impact of vacancy defects on CNT interconnects: From statistical atomistic study to circuit simulations, International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp.157-160, 2017.
URL : https://hal.archives-ouvertes.fr/lirmm-01795799

J. Lee, J. Liang, S. M. Amoroso, T. Sadi, L. Wang et al., Atoms-to-circuits simulation investigation of CNT interconnects for next generation CMOS technology, International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp.153-156, 2017.
URL : https://hal.archives-ouvertes.fr/lirmm-01795803

A. Magnani, M. De-magistris, S. Heidari, A. Todri-sanial, and A. Maffucci, Electrical performance of carbon-based power distribution networks with thermal effects, IEEE 21st Workshop on Signal and Power Integrity, pp.1-4, 2017.
URL : https://hal.archives-ouvertes.fr/lirmm-01795816

J. Liang, L. Zhang, N. Azemard-crestani, P. Nouet, and A. Todri, Physical description and analysis of doped carbon nanotube interconnects, International Workshop on Power and Timing Modeling, Optimization and Simulation (PATMOS), pp.250-255, 2016.
URL : https://hal.archives-ouvertes.fr/lirmm-01457338

A. Todri, Investigation of electrical and thermal properties of carbon nanotube interconnects, International Workshop on Power and Timing Modeling, Optimization and Simulation (PATMOS), pp.25-32, 2016.
URL : https://hal.archives-ouvertes.fr/lirmm-01457289

A. Todri-sanial, A. Magnani, M. De-magistris, and A. Maffucci, Present and future prospects of carbon nanotube interconnects for energy efficient integrated circuits, International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp.1-5, 2016.
URL : https://hal.archives-ouvertes.fr/lirmm-01446241