Electromagnetic analysis of the field radiated by ICs is a common practice in the field of hardware security, especially for reverse engineering or to disclose cryptographic keys. While surprisingly the scaling of CMOS technologies carries on, it is important to scale down the sensors used to perform such analyses. Within this context, this paper explores the potential of flexible and 3D printing technologies to design low cost, electrically and mechanically robust electromagnetic probes with spatial resolution about 50µm while the standard is currently about 100µm.