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 Smart Integrated Electronic Systems

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Beyond-CMOS devices Integrated circuits Clocks Three-dimensional integrated circuits Sensors Calibration Power supplies Bandwidth Test Specifications Indirect test Noise ATE programming Alternate testing Edge artificial intelligence edge AI Thermal sensor Interconnect CMOS Neuromorphic computing Circuit simulation Digital ATE Technology computer-aided design TCAD OQPSK SRAM Alternate test Quantum computing Carbon nanotube Logic gates Delays Self-heating Automatic test pattern generation Low power Carbon nanotubes Integrated circuit testing Vanadium dioxide Self-oscillations 3D integration SEU Copper Indirect testing Accelerometer Interconnects Security 1-bit acquisition RF test Computer architecture Integrated circuit interconnections Through-silicon vias Analytical models Microprocessors Bioimpedance spectroscopy Electrothermal analysis 3D FDSOI technology Pattern recognition RF integrated circuits Secure IC Evaluation Side-channel analysis Analog/RF integrated circuits Time-domain analysis Integrated circuit design Magnetic tunneling Test efficiency Reliability MEMS Transistors Test confidence BIST Machine-learning algorithms Power demand Design RSA Three-dimensional displays Electrothermal simulation Phase noise Analog signals Switches Temperature distribution Integrated circuit reliability Integrated circuit noise Advanced PMA STT-MRAM Bioimpedance ZigBee Digital signal processing Phase shifter Noise measurement Monitoring Education Analog/IF signals Ensemble methods Process variability Integrated circuit modeling Circuit faults Fault tolerance Analog and RF integrated circuits Low-cost measurements Oscillatory neural networks ONN One bit acquisition Test cost reduction