Smart Integrated Electronic Systems

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Current conveyor Bioimpedance Interconnect Specifications Temperature distribution Advanced PMA STT-MRAM Built-In-Self-Test Cu-CNT composites Power demand Analog signals Reliability Carbon nanotube Integrated circuit reliability Integrated circuits Circuits Integrated circuit modeling Brainstorming Biosensor Heating Analytical models Data fusion Accelerometers Analog/RF integrated circuits Automatic test pattern generation Carbon nanotubes Indirect testing Capacitors Bioimpedance spectroscopy Process variability Integrated circuit interconnections 1-bit acquisition Three-dimensional displays Through-silicon vias Computer architecture Accelerometer Phase shifter Copper Test CMOS memory circuits Secure IC Defects Three-dimensional integrated circuits Transistors Sensors Noise Bandwidth Time-domain analysis 3D Test cost reduction Convective accelerometer Alternate test Low power SEU Test efficiency Monitoring Switches BIST SRAM Correlation Low-cost measurements Noise measurement RF test Interconnects Microprocessors Digital signal processing CMOS RSA Phase noise Integrated circuit noise Logic gates Circuit Carbon nanotube interconnects Digital ATE Clocks Analog/IF signals ATE programming Education Integrated circuit design Design Competencies 3D integration Side-channel analysis Current mirror Calibration Electrothermal analysis Integrated circuit testing MEMS Delays Alternate testing Analog and RF integrated circuits Circuit faults Power supplies Evaluation One bit acquisition FDSOI technology Critical path delay COTS Thermal sensor OQPSK Magnetic tunneling