HAL will be down for maintenance from Friday, June 10 at 4pm through Monday, June 13 at 9am.
More information
Skip to Main content
Skip to Navigation
Toggle navigation
Sign in
Sign in
Sign in with ORCID
se connecter avec Fédération
Create account
Forgot your password?
Have you forgotten your login?
fr
en
SmartIES
Homepage
Deposit
Consult
by author
by period
by doctype
by journal
by conference
by ANR project
latest deposit
Evaluation
Homepage
Search
SMARTIES
Smart Integrated Electronic Systems
Consult your copyright
Titre du journal ou ISSN
Editeur
Number of Files
215
Nomber of Notices
176
Collaborations’ map
Tags
One bit acquisition
Carbon nanotubes
Test efficiency
Integrated circuit testing
Automatic test pattern generation
OQPSK
Phase shifter
Hardware security
Test
Noise
Design
Pattern recognition
Current mirror
Education
Circuit simulation
Transistors
Side-channel analysis
Neuromorphic computing
SEU
Digital signal processing
Hardware
Interconnects
Digital ATE
Calibration
Ensemble methods
Fault tolerance
Microprocessors
Self-oscillations
Logic gates
Power demand
Delays
Computer
Beyond-CMOS devices
Test cost reduction
RF test
Noise measurement
Electronic tagging
Oscillatory neural networks ONN
Self-heating
Magnetic tunneling
EVM measurement
1-bit acquisition
RF integrated circuits
Security
Copper
Integrated circuit reliability
RSA
Phase noise
Alternate testing
Monitoring
Circuit faults
Integrated circuit modeling
Process variability
FDSOI technology
Indirect testing
Switches
Indirect test
Quantum
Machine-learning algorithms
Low-cost measurements
Fault attacks
Sensors
Test confidence
Bandwidth
Integrated circuits
Computer architecture
Technology computer-aided design TCAD
Performance
Power supplies
Interconnect
Vanadium dioxide
Electrothermal simulation
EM fault injection
SRAM
Analog signals
Bioimpedance spectroscopy
Analog/RF integrated circuits
Quantum computing
Mutual information
MEMS
Secure IC
Integrated circuit interconnections
Insulator-Metal-Transition IMT
Carbon nanotube
Reliability
Integrated circuit design
Bioimpedance
3D integration
Through-silicon vias
CMOS
Integrated circuit noise
Edge artificial intelligence edge AI
ZigBee
Low power
Biosensor
Three-dimensional displays
3D
Clocks
Electrothermal analysis
Evaluation