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The SMARTIES (Smart Integrated Electronic Systems) team focuses on design methods and modeling devices, systems, and integrated circuits. These activities comprise the development of methods, tools, and principles based on physical or electrical simulation approaches. Our main contributions include work on the continuity and extension of, or break with, Moore’s law, the impact of emerging technologies (FDSOI and FINFET) on design methods or functional block architectures, integration approaches (3D stacking and 3D monolithic integration), and heterogeneous integration with novel devices (MRAM, Carbon Nanotubes) on inte-grated circuits. This research is usually paralleled by technological demonstrations (specific circuits, bench experiments, model integration in simulators, etc.), which allow us to illustrate our work with practical examples relating to the transversal research lines of the Department.


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Self-oscillations Low-power Fault attacks Neuromorphic computing CMOS analog design Edge artificial intelligence edge AI Current mirror Noise measurement Ensemble methods 1-bit acquisition Integrated circuit testing Microprocessors Edge AI Energy Three-dimensional displays Bioimpedance Quantum computing Beyond-CMOS devices Digital ATE Sensors Logic gates FDSOI technology Convective accelerometer Technology computer-aided design TCAD Indirect test Delays Circuit faults Deep learning Pattern recognition Test confidence Power demand EM fault injection Bioimpedance spectroscopy Bio-logging Oscillatory Neural Networks Countermeasures Transistors Calibration Vanadium dioxide Low-cost measurements Oscillatory neural networks ONN Indirect testing Hardware security RSA Magnetic tunneling Machine-learning algorithms Mutual information Circuit simulation Fault tolerance Quantum OQPSK Education RF integrated circuits Automatic test pattern generation Qubit ZigBee Phase shifter SRAM Analog/RF integrated circuits Test efficiency Interconnects RF test Image Edge Detection Carbon nanotube Computer architecture Through-silicon vias Switches Reliability SEU Digital signal processing Integrated circuit modeling Process variability Electrothermal simulation 3D integration Alternate testing Error mitigation Evaluation Image edge detection Electronic tagging Oscillatory neural network Analog signals NP-hard problems Side-channel analysis Insulator-Metal-Transition IMT Simulation Current conveyor High-current drive Self-heating Hardware Oscillatory Neural Network Integrated circuit noise Performance Phase noise Integrated circuits Carbon nanotubes MEMS Test cost reduction Noise Test One bit acquisition