Skip to Main content Skip to Navigation



 Smart Integrated Electronic Systems

Consult your copyright

Number of Files


Nomber of Notices


Collaborations’ map


Integrated circuit noise Digital signal processing Evaluation FDSOI technology Analog/RF integrated circuits Sensors Interconnect Pattern recognition Through-silicon vias Bioimpedance spectroscopy Noise Integrated circuit testing Technology computer-aided design TCAD Self-oscillations 3D integration Monitoring RF test Accelerometer Phase noise Analytical models Integrated circuit reliability Three-dimensional integrated circuits RF integrated circuits CMOS Clocks Indirect testing 1-bit acquisition Specifications Interconnects Integrated circuits ATE programming Test confidence Thermal sensor Side-channel analysis Carbon nanotubes Low-cost measurements Bandwidth Edge artificial intelligence edge AI OQPSK Education Time-domain analysis Magnetic tunneling 3D Low power Temperature distribution Oscillatory neural networks ONN Ensemble methods Circuit faults Secure IC Test cost reduction Test efficiency Copper Phase shifter Carbon nanotube Transistors Analog signals Integrated circuit design Vanadium dioxide Beyond-CMOS devices Quantum computing Digital ATE Self-heating Design Power supplies Computer architecture ZigBee Calibration Advanced PMA STT-MRAM SEU Power demand Indirect test Neuromorphic computing Delays Switches Automatic test pattern generation Alternate test Noise measurement Logic gates MEMS Alternate testing Electrothermal simulation Three-dimensional displays Analog/IF signals Security Microprocessors Integrated circuit interconnections Circuit simulation Test Analog and RF integrated circuits Integrated circuit modeling BIST Machine-learning algorithms Electrothermal analysis SRAM One bit acquisition Fault tolerance RSA Bioimpedance Process variability Reliability