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 Smart Integrated Electronic Systems

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Indirect testing Integrated circuit noise Digital signal processing Bioimpedance spectroscopy Evaluation Bioimpedance Temperature distribution Circuit faults Sensors Analog/RF integrated circuits RSA Switches Security Reliability Through-silicon vias Carbon nanotube Time-domain analysis Bandwidth Test Three-dimensional displays Process variability Power demand Noise Interconnects RF integrated circuits Automatic test pattern generation Fault tolerance RF test Beyond-CMOS devices Logic gates Accelerometer 1-bit acquisition Digital ATE Microprocessors ZigBee CMOS Computer architecture Phase noise Oscillatory neural networks ONN Specifications Integrated circuits Copper Vanadium dioxide Interconnect Alternate testing Integrated circuit interconnections Test efficiency Monitoring Analog signals Analytical models Test cost reduction SRAM Electrothermal analysis Education OQPSK Carbon nanotubes Self-heating Side-channel analysis Machine-learning algorithms Transistors Integrated circuit modeling ATE programming Secure IC Test confidence Integrated circuit reliability Calibration Alternate test Analog and RF integrated circuits Indirect test FDSOI technology Technology computer-aided design TCAD Quantum computing Three-dimensional integrated circuits Phase shifter Integrated circuit testing Edge artificial intelligence edge AI Pattern recognition Noise measurement One bit acquisition Delays Electrothermal simulation Thermal sensor 3D integration Clocks SEU Low power Ensemble methods Circuit simulation BIST Low-cost measurements Design Neuromorphic computing Integrated circuit design Advanced PMA STT-MRAM MEMS Self-oscillations 3D Analog/IF signals Power supplies Magnetic tunneling