Remote Access to Manufacturing Test Facilities: a Reality in IC, a dream in MEMS

Laurent Latorre 1 Pascal Nouet 1 Pascal Dugénie 2 Stefano A. Cerri 2
1 SysMIC - Conception et Test de Systèmes MICroélectroniques
LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
2 SMILE - Système Multi-agent, Interaction, Langage, Evolution
LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
Abstract : Manufacturing test consists in verifying the quality of a product with respect to its specifications. For most of the manufactured products the cost of the final verification represents only a small part of the production costs. This is due to the fact that these products are either high-cost (e.g. automotive industry) or reliable enough to authorize randomly applied verification (e.g. food industry). This scheme doesn't apply in the microelectronics industry, where low-cost products are produced with a significant number of out-of-specification or non-functioning parts. Manufacturing tests are then required to verify the physical integrity and the correct behaviour of any produced parts at a reasonable cost. Mass production of MNT-based systems is following the same trend. That's the reason why we have to learn from this mature industry. The problem is that manufacturing test introduces a breakage in the batch fabrication concept. Indeed, speaking about malfunctions leads to singularities that cannot be dealt in a batch-based model. Even if test is undertaken at the wafer level and if parallelism is still possible each produced device must be tested independently.
Type de document :
Autre publication
MST News. 2006, pp.39-41
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https://hal-lirmm.ccsd.cnrs.fr/lirmm-00128278
Contributeur : Pascal Nouet <>
Soumis le : mercredi 31 janvier 2007 - 15:16:09
Dernière modification le : jeudi 24 mai 2018 - 15:59:24

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Laurent Latorre, Pascal Nouet, Pascal Dugénie, Stefano A. Cerri. Remote Access to Manufacturing Test Facilities: a Reality in IC, a dream in MEMS. MST News. 2006, pp.39-41. 〈lirmm-00128278〉

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