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Impact of Technology Spreading on MEMS Design Robustness

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Abstract

This paper addresses the characterization of MEMS structures, industrially manufactured using front-side bulk micro-machining post-process techniques on CMOS dies. The systematic characterization of mechanical parameters, such as stiffness or mass, on a set of 100 cantilever devices provides us with ground knowledge concerning process parameter variations. Taking into account the foundry-given process parameter spreading such as the layer thickness uncertainties characterization results are compared with simulation results obtained using Monte-Carlo analysis in standard CAD environment. This study can be considered as a first step in the development of a global monolithic MEMS design methodology.
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Dates and versions

lirmm-00268485 , version 1 (04-10-2022)

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Vincent Beroulle, Laurent Latorre, Muriel Dardalhon, Coumar Oudéa, Guy Perez, et al.. Impact of Technology Spreading on MEMS Design Robustness. SOC Design Methodologies, 90, Kluwer Academic Publishers, pp.241-251, 2002, IFIP — The International Federation for Information Processing, 978-1-4757-6530-4. ⟨10.1007/978-0-387-35597-9_21⟩. ⟨lirmm-00268485⟩
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