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Impact of Technology Spreading on MEMS Design Robustness

Abstract : This paper addresses the characterization of MEMS structures, industrially manufactured using front-side bulk micro-machining post-process techniques on CMOS dies. The systematic characterization of mechanical parameters, such as stiffness or mass, on a set of 100 cantilever devices provides us with ground knowledge concerning process parameter variations. Taking into account the foundry-given process parameter spreading such as the layer thickness uncertainties characterization results are compared with simulation results obtained using Monte-Carlo analysis in standard CAD environment. This study can be considered as a first step in the development of a global monolithic MEMS design methodology.
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https://hal-lirmm.ccsd.cnrs.fr/lirmm-00268485
Contributor : Christine Carvalho de Matos <>
Submitted on : Tuesday, April 1, 2008 - 9:27:29 AM
Last modification on : Friday, June 5, 2020 - 10:32:06 AM

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Vincent Beroulle, Laurent Latorre, Muriel Dardalhon, Coumar Oudéa, Guy Perez, et al.. Impact of Technology Spreading on MEMS Design Robustness. SoC Design Methodologies - International Conference on Very Large Scale Integration of Systems-on-Chip, Dec 2001, Montpellier, France. pp.241-251, ⟨10.1007/978-0-387-35597-9_21⟩. ⟨lirmm-00268485⟩

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