Impact of Technology Spreading on MEMS Design Robustness

Abstract : This paper addresses the characterization of MEMS structures, industrially manufactured using front-side bulk micro-machining post-process techniques on CMOS dies. The systematic characterization of mechanical parameters, such as stiffness or mass, on a set of 100 cantilever devices provides us with ground knowledge concerning process parameter variations. Taking into account the foundry-given process parameter spreading such as the layer thickness uncertainties characterization results are compared with simulation results obtained using Monte-Carlo analysis in standard CAD environment. This study can be considered as a first step in the development of a global monolithic MEMS design methodology.
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Communication dans un congrès
SoC Design Methodologies - International Conference on Very Large Scale Integration of Systems-on-Chip, Dec 2001, Montpellier, France. Kluwer Academic Publishers, PIFIP TC10 / WG10.5 Eleventh International Conference on Very Large Scale Integration of Systems-on-Chip (VLSI-SOC’01) December 3–5, 2001, Montpellier, France, pp.241-251, 2002, 〈10.1007/978-0-387-35597-9_21〉
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https://hal-lirmm.ccsd.cnrs.fr/lirmm-00268485
Contributeur : Christine Carvalho de Matos <>
Soumis le : mardi 1 avril 2008 - 09:27:29
Dernière modification le : jeudi 11 janvier 2018 - 02:08:13

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Vincent Beroulle, Laurent Latorre, M. Dardalhon, C. Oudea, G. Perez, et al.. Impact of Technology Spreading on MEMS Design Robustness. SoC Design Methodologies - International Conference on Very Large Scale Integration of Systems-on-Chip, Dec 2001, Montpellier, France. Kluwer Academic Publishers, PIFIP TC10 / WG10.5 Eleventh International Conference on Very Large Scale Integration of Systems-on-Chip (VLSI-SOC’01) December 3–5, 2001, Montpellier, France, pp.241-251, 2002, 〈10.1007/978-0-387-35597-9_21〉. 〈lirmm-00268485〉

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