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Towards New Low-Cost Multi-Sensor Systems

Abstract : For non-critical applications, consumer electronics requires more and more sensing components such as pressure sensors, accelerometers, magnetometers, flowmeters, microphones... Generally, each of these sensors is manufactured with a dedicated technology that involves specific materials and process flows together with either surface or bulk micromachining. The final multi-sensor system is then assembled on a PCB resulting in high manufacturing cost. In this paper, we propose an alternative where various MEMS-based sensors may be fabricated by direct bulk micromachining of the passive silicon substrate used for System-In-Package integration
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Contributor : Frédérick Mailly Connect in order to contact the contributor
Submitted on : Friday, September 26, 2008 - 11:02:40 AM
Last modification on : Friday, August 5, 2022 - 10:48:21 AM


  • HAL Id : lirmm-00325075, version 1



Boris Alandry, Frédérick Mailly, Laurent Latorre, Fabrice Verjus, Olivier Garel, et al.. Towards New Low-Cost Multi-Sensor Systems. EUROSENSORS, Sep 2008, Desden, Germany. pp.549-552. ⟨lirmm-00325075⟩



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