Towards New Low-Cost Multi-Sensor Systems

Abstract : For non-critical applications, consumer electronics requires more and more sensing components such as pressure sensors, accelerometers, magnetometers, flowmeters, microphones... Generally, each of these sensors is manufactured with a dedicated technology that involves specific materials and process flows together with either surface or bulk micromachining. The final multi-sensor system is then assembled on a PCB resulting in high manufacturing cost. In this paper, we propose an alternative where various MEMS-based sensors may be fabricated by direct bulk micromachining of the passive silicon substrate used for System-In-Package integration
Type de document :
Communication dans un congrès
EUROSENSORS XXII 2008, Sep 2008, pp.549-552, 2008
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Contributeur : Frédérick Mailly <>
Soumis le : vendredi 26 septembre 2008 - 11:02:40
Dernière modification le : jeudi 24 mai 2018 - 15:59:24


  • HAL Id : lirmm-00325075, version 1



Boris Alandry, Frédérick Mailly, Laurent Latorre, Fabrice Verjus, Olivier Garel, et al.. Towards New Low-Cost Multi-Sensor Systems. EUROSENSORS XXII 2008, Sep 2008, pp.549-552, 2008. 〈lirmm-00325075〉



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