Pressure Sensor for Smart Wafer-Level Packaging of MEMS

Abstract : Systems in Package (SiP) contain more and more MEMS components such as resonators for time references or RF filtering. These resonators are packaged at wafer level and the cavity quality has to be guaranteed in terms of pressure and humidity level by the final manufacturing test. Therefore, environmental sensors could be integrated in the cavity to control these parameters and/or to calibrate the MEMS resonator with an electronic loopback. This paper presents the design of a low-cost pressure sensor for such application.
Type de document :
Poster
EUROSENSORS XXII 2008, Sep 2008, Dresden, Allemagne, pp.408-411, 2008
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https://hal-lirmm.ccsd.cnrs.fr/lirmm-00325109
Contributeur : Frédérick Mailly <>
Soumis le : vendredi 26 septembre 2008 - 11:42:54
Dernière modification le : jeudi 11 janvier 2018 - 06:27:18

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  • HAL Id : lirmm-00325109, version 1

Citation

Nicolas Pous, Frédérick Mailly, Laurent Latorre, Emile Martincic, Fabrice Verjus, et al.. Pressure Sensor for Smart Wafer-Level Packaging of MEMS. EUROSENSORS XXII 2008, Sep 2008, Dresden, Allemagne, pp.408-411, 2008. 〈lirmm-00325109〉

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