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Poster communications

Pressure Sensor for Smart Wafer-Level Packaging of MEMS

Abstract : Systems in Package (SiP) contain more and more MEMS components such as resonators for time references or RF filtering. These resonators are packaged at wafer level and the cavity quality has to be guaranteed in terms of pressure and humidity level by the final manufacturing test. Therefore, environmental sensors could be integrated in the cavity to control these parameters and/or to calibrate the MEMS resonator with an electronic loopback. This paper presents the design of a low-cost pressure sensor for such application.
Document type :
Poster communications
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Contributor : Frédérick Mailly <>
Submitted on : Friday, September 26, 2008 - 11:42:54 AM
Last modification on : Wednesday, October 14, 2020 - 3:56:49 AM


  • HAL Id : lirmm-00325109, version 1


Nicolas Pous, Frédérick Mailly, Laurent Latorre, Emile Martincic, Fabrice Verjus, et al.. Pressure Sensor for Smart Wafer-Level Packaging of MEMS. EUROSENSORS, Sep 2008, Dresden, Germany. 22nd European Conference on Solid-State Transducers, pp.408-411, 2008. ⟨lirmm-00325109⟩



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