In this paper, we investigate potential solutions for the development of an electrical-only test procedure for MEMS convective accelerometers. The objective is to define an alternative low-cost test procedure applicable at wafer-level. Simple electrical test measurements are analyzed and a behavioral model allowing fault injection is developed. Simulation results show that most of the parametric faults that affect the device specifications can be detected with electrical measurements. Only faults that affect the convective behavior escape this alternative test. A preliminary study of convective effects using FEM simulation is then conducted to identify the key parameters that should be included in the model for the subsequent definition of adequate electrical test parameters.