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Resistive-Open Defect Analysis for Through-Silicon-Vias

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https://hal-lirmm.ccsd.cnrs.fr/lirmm-00806803
Contributor : Arnaud Virazel <>
Submitted on : Tuesday, April 2, 2013 - 1:44:29 PM
Last modification on : Friday, November 27, 2020 - 6:04:03 PM

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  • HAL Id : lirmm-00806803, version 1

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Carolina Momo Metzler, Aida Todri-Sanial, Alberto Bosio, Luigi Dilillo, Patrick Girard, et al.. Resistive-Open Defect Analysis for Through-Silicon-Vias. DCIS: Design of Circuits and Integrated Systems, 2012, Avignon, France. ⟨lirmm-00806803⟩

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