Resistive-Open Defect Analysis for Through-Silicon-Vias

Type de document :
Communication dans un congrès
DCIS: Design of Circuits and Integrated Systems, 2012, Avignon, France. XXVII Conference on Design of Circuits and Integrated Systems, 2012
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https://hal-lirmm.ccsd.cnrs.fr/lirmm-00806803
Contributeur : Arnaud Virazel <>
Soumis le : mardi 2 avril 2013 - 13:44:29
Dernière modification le : jeudi 24 mai 2018 - 15:59:24

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  • HAL Id : lirmm-00806803, version 1

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Carolina Metzler, Aida Todri, Alberto Bosio, Luigi Dilillo, Patrick Girard, et al.. Resistive-Open Defect Analysis for Through-Silicon-Vias. DCIS: Design of Circuits and Integrated Systems, 2012, Avignon, France. XXVII Conference on Design of Circuits and Integrated Systems, 2012. 〈lirmm-00806803〉

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