Resistive-Open Defect Analysis for Through-Silicon-Vias - LIRMM - Laboratoire d’Informatique, de Robotique et de Microélectronique de Montpellier Access content directly
Conference Papers Year : 2012

Resistive-Open Defect Analysis for Through-Silicon-Vias


Three-dimensional (3D) integration is a fast emerging technology that offers integration of high density, fast performance and heterogeneous circuits in a small footprint. Through-Silicon-Vias (TSVs) enable 3D integration by providing fast performance and short interconnects among tiers. However, they are also susceptible to defects that occur during manufacturing steps and cause crucial reliability issues. In this paper, we perform an in-depth analysis of resistive-open defects (ROD) on TSVs for various scenarios. We consider TSV ROD analysis in the presence of voltage drop, ground bounce, and coupling effects (i.e. inductive and capacitive) for a wide frequency spectrum. We perform a study on a three-tier structure and demonstrate conditions in which TSVs start to fail. Furthermore, we show the impact that the electrical behavior of the multi-tier network has on TSV performance.
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Dates and versions

lirmm-00806803 , version 1 (02-04-2013)


  • HAL Id : lirmm-00806803 , version 1


Carolina Momo Metzler, Aida Todri-Sanial, Alberto Bosio, Luigi Dilillo, Patrick Girard, et al.. Resistive-Open Defect Analysis for Through-Silicon-Vias. DCIS 2012 - 27th Conference on Design of Circuits and Integrated Systems, Nov 2012, Avignon, France. ⟨lirmm-00806803⟩
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