Design of a Monolithic 3-axis Thermal Convective Accelerometer

Huy Binh Nguyen 1 Frédérick Mailly 1 Laurent Latorre 1 Pascal Nouet 1
1 SysMIC - Conception et Test de Systèmes MICroélectroniques
LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
Abstract : This paper presents the design of a monolithic 3- axis thermal accelerometer using a standard CMOS process. Based on free convection in a sealed cavity, the sensing principle is well known and many examples of single and dual-axis MEMS accelerometers can be found in the literature. More recently, Finite Element Modeling has demonstrated the feasibility of a fully integrated 3-axis sensor manufactured with a simple post-process to partially etch silicon bulk of a CMOS die. A prototype was designed and fabricated; this paper presents the sensing cell, its associated conditioning electronics and preliminary characterization.
Type de document :
Communication dans un congrès
DTIP: Design, Test, Integration and Packaging, Apr 2013, Barcelona, Spain. Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, pp.235-238, 2013
Liste complète des métadonnées

https://hal-lirmm.ccsd.cnrs.fr/lirmm-00814222
Contributeur : Frédérick Mailly <>
Soumis le : mercredi 17 avril 2013 - 09:29:29
Dernière modification le : jeudi 24 mai 2018 - 15:59:24

Identifiants

  • HAL Id : lirmm-00814222, version 1

Collections

Citation

Huy Binh Nguyen, Frédérick Mailly, Laurent Latorre, Pascal Nouet. Design of a Monolithic 3-axis Thermal Convective Accelerometer. DTIP: Design, Test, Integration and Packaging, Apr 2013, Barcelona, Spain. Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, pp.235-238, 2013. 〈lirmm-00814222〉

Partager

Métriques

Consultations de la notice

121