Asynchronous Design for Harsh Environments

Jeremy Lopes 1, 2, 3 Gregory Di Pendina 3 Edith Beigne 4 Lionel Torres 2
1 CNES - Centre National d'Etudes Spatiales
2 SysMIC - Conception et Test de Systèmes MICroélectroniques
LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
3 SPINTEC - UMR 8191 - SPINtronique et technologie des composants
4 CEA-LETI - Laboratoire d'Electronique et des Technologies de l'Information
Abstract : Radiation robust circuit design for harsh environments like space is a big challenge for today engineers and researchers. As circuits become more and more complex and CMOS processes get denser and smaller, their immunity towards particle strikes decreases drastically. This work has for objective to improve the SoC robustness against particle attacks targeting very advanced processes. This should be possible combining three already proven robust design techniques: Asynchronous communication, Silicon on Insulator (SOI) technologies and Spintronics (MRAM). The combination of these three techniques should give some fundamentally new architecture with higher performances than what is available today in terms of robustness but also in terms of speed, consumption and surface.
Type de document :
Communication dans un congrès
ASYNC: International Symposium on Asynchronous Circuits and Systems, May 2015, Montain View, Silicon Valley, California, United States. IEEE, 21st IEEE International Symposium on Asynchronous Circuits and Systems, 2015, 〈http://ee.usc.edu/async2015/〉
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Contributeur : Jeremy Lopes <>
Soumis le : mardi 5 janvier 2016 - 11:23:25
Dernière modification le : jeudi 28 juin 2018 - 15:12:05
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Jeremy Lopes, Gregory Di Pendina, Edith Beigne, Lionel Torres. Asynchronous Design for Harsh Environments. ASYNC: International Symposium on Asynchronous Circuits and Systems, May 2015, Montain View, Silicon Valley, California, United States. IEEE, 21st IEEE International Symposium on Asynchronous Circuits and Systems, 2015, 〈http://ee.usc.edu/async2015/〉. 〈lirmm-01250722〉

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