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Proceedings of Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP 2014)

Bernard Courtois 1 Jean-Michel Karam 2 Romolo Marcelli 3 Souhil Megherbi 4 Yoshio Mita 5 Pascal Nouet 6 Andrew J. Yeh 7 
1 CMP - Circuits Multi-Projets
2 Memscap
3 IMM - Istituto per la Microelettronica e Microsistemi [Roma]
4 IEF - Institut d'électronique fondamentale
5 UTokyo - The University of Tokyo
6 SysMIC - Conception et Test de Systèmes MICroélectroniques
LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
7 NTHU - National Tsing Hua University [Hsinchu]
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https://hal-lirmm.ccsd.cnrs.fr/lirmm-01434883
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Submitted on : Tuesday, July 21, 2020 - 10:47:42 PM
Last modification on : Friday, August 5, 2022 - 10:48:22 AM
Long-term archiving on: : Tuesday, December 1, 2020 - 4:03:05 AM

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  • HAL Id : lirmm-01434883, version 1

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UGA | CNRS | SYSMIC | LIRMM | LIRMM_MIC | MIC | MIPS | UNIV-MONTPELLIER

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Bernard Courtois, Jean-Michel Karam, Romolo Marcelli, Souhil Megherbi, Yoshio Mita, et al.. Proceedings of Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP 2014). Vice General Chair: Pascal NOUET. Apr 2014, Cannes, France. EDA Publishing, 2014. ⟨lirmm-01434883⟩

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