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Books Year : 2017

Carbon nanotubes for Interconnects

Abstract

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Dates and versions

lirmm-01444977 , version 1 (24-01-2017)

Identifiers

Cite

Aida Todri-Sanial, Jean Dijon, Antonio Maffucci (Dir.). Carbon nanotubes for Interconnects: Process, Design and Applications. Aida Todri-Sanial, Jean Dijon, Antonio Maffuci. Springer International Publishing, 2017, 978-3-319-29744-6 (Print) 978-3-319-29746-0 (Online). ⟨10.1007/978-3-319-29746-0⟩. ⟨lirmm-01444977⟩
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