Exploring Carbon Nanotubes for 3D Power Delivery Networks

Aida Todri-Sanial 1
1 SysMIC - Conception et Test de Systèmes MICroélectroniques
LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
Abstract : Carbon nanotubes (CNTs) due their unique mechanical, thermal, and electrical properties are being investigated as promising candidate material for on-chip and off-chip interconnects. The attractive mechanical properties of CNTs, including high Young’s modulus, resiliency, and low thermal expansion coefficient offer great advantage for reliable and strong interconnects, and even more so for 3D integration. Through-Silicon-Vias (TSVs) enable 3D integration and implementation of denser, faster, and heterogeneous circuits, which also lead to excessive power densities and elevated temperatures. Due to their unique properties, CNTs present an opportunity to address these challenges and provide solutions for reliable power delivery networks in 2D and 3D integration. In this chapter, we perform detailed analyses of horizontally aligned CNTs and report on their efficiency to be exploited for both 2D and 3D power delivery networks.
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Chapitre d'ouvrage
Aida Todri-Sanial, Jean Dijon, Antonio Maffuci. Carbon Nanotubes for Interconnects, CRC Press, pp.283-314, 2016, 978-3-319-29746-0. 〈10.1007/978-3-319-29746-0_10〉
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https://hal-lirmm.ccsd.cnrs.fr/lirmm-01445018
Contributeur : Caroline Lebrun <>
Soumis le : mardi 24 janvier 2017 - 14:57:22
Dernière modification le : jeudi 11 janvier 2018 - 06:27:19

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Aida Todri-Sanial. Exploring Carbon Nanotubes for 3D Power Delivery Networks. Aida Todri-Sanial, Jean Dijon, Antonio Maffuci. Carbon Nanotubes for Interconnects, CRC Press, pp.283-314, 2016, 978-3-319-29746-0. 〈10.1007/978-3-319-29746-0_10〉. 〈lirmm-01445018〉

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