A hierarchical model for CNT and Cu-CNT composite interconnects: from density functional theory to circuit-level simulations

Lee Jaehyun 1 Sadi Toufik 1 Jie Liang 2 Vihar Georgiev 1 Aida Todri-Sanial 2 Asenov Asen
2 SmartIES - Smart Integrated Electronic Systems
LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
Abstract : Metallic carbon nanotubes (CNTs) and Cu- CNT composites have been regarded for years as one of the promising candidates for the future interconnects to replace Cu. Due to CNTs’ small effective mass and 1-D structure, and strong C-C bonding, they have a very high ampacity, a large mean free path (λ), and excellent mechanical properties [1]. In this work, we have investigated the transport properties of CNT interconnects based on density functional theory (DFT) and compact model analysis. We also propose a hierarchical model to connect the DFT with circuit-level simulations.
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https://hal-lirmm.ccsd.cnrs.fr/lirmm-01800290
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Submitted on : Friday, May 25, 2018 - 5:00:03 PM
Last modification on : Wednesday, July 17, 2019 - 9:35:36 AM
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  • HAL Id : lirmm-01800290, version 1

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Lee Jaehyun, Sadi Toufik, Jie Liang, Vihar Georgiev, Aida Todri-Sanial, et al.. A hierarchical model for CNT and Cu-CNT composite interconnects: from density functional theory to circuit-level simulations. IWCN: International Workshop on Computational Nanotechnology, Jun 2017, Windermere, United Kingdom. ⟨lirmm-01800290⟩

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