A hierarchical model for CNT and Cu-CNT composite interconnects: from density functional theory to circuit-level simulations - LIRMM - Laboratoire d’Informatique, de Robotique et de Microélectronique de Montpellier Access content directly
Conference Papers Year : 2017

A hierarchical model for CNT and Cu-CNT composite interconnects: from density functional theory to circuit-level simulations

Jie Liang
  • Function : Author
  • PersonId : 971767
Aida Todri-Sanial
Asenov Asen
  • Function : Author

Abstract

Metallic carbon nanotubes (CNTs) and Cu- CNT composites have been regarded for years as one of the promising candidates for the future interconnects to replace Cu. Due to CNTs’ small effective mass and 1-D structure, and strong C-C bonding, they have a very high ampacity, a large mean free path (λ), and excellent mechanical properties [1]. In this work, we have investigated the transport properties of CNT interconnects based on density functional theory (DFT) and compact model analysis. We also propose a hierarchical model to connect the DFT with circuit-level simulations.
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Dates and versions

lirmm-01800290 , version 1 (25-05-2018)

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  • HAL Id : lirmm-01800290 , version 1

Cite

Lee Jaehyun, Sadi Toufik, Jie Liang, Vihar Petkov Georgiev, Aida Todri-Sanial, et al.. A hierarchical model for CNT and Cu-CNT composite interconnects: from density functional theory to circuit-level simulations. IWCN: International Workshop on Computational Nanotechnology, Jun 2017, Windermere, United Kingdom. ⟨lirmm-01800290⟩
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