Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects
Benjamin Uhlig
(1)
,
Abitha Dhavamani
(1)
,
Nicole Nagy
(1)
,
Katharina Lilienthal
(1)
,
R. Liske
,
Raphael Ramos
(2)
,
Jean Dijon
(2)
,
Hanako Okuno
(3)
,
Dipankar Kalita
(3)
,
Lee Jaehyun
(4)
,
Vihar P. Georgiev
(5)
,
Asenov Asen
(5)
,
Salvatore Amoroso
(6)
,
Liping Wang
(6)
,
Koenemann Fabien
,
Bernd Gotsmann
(7)
,
Goncalo Goncalves
(8)
,
Bingam Cheng
,
Jie Liang
(9)
,
Reetu Raj Pandey
(9)
,
Rongmei Chen
(9)
,
Aida Todri-Sanial
(9)
1
Fraunhofer IPM -
Fraunhofer Institute for Physical Measurement Techniques
2 LITEN - Laboratoire d'Innovation pour les Technologies des Energies Nouvelles et les nanomatériaux
3 LEMMA - Laboratoire d'Etude des Matériaux par Microscopie Avancée
4 University of Glasgow
5 James Watt School of Engineering [Univ Glasgow]
6 Synopsys Inc.
7 IBM Research Laboratory [Zurich]
8 Aixtron (UK)
9 SmartIES - Smart Integrated Electronic Systems
2 LITEN - Laboratoire d'Innovation pour les Technologies des Energies Nouvelles et les nanomatériaux
3 LEMMA - Laboratoire d'Etude des Matériaux par Microscopie Avancée
4 University of Glasgow
5 James Watt School of Engineering [Univ Glasgow]
6 Synopsys Inc.
7 IBM Research Laboratory [Zurich]
8 Aixtron (UK)
9 SmartIES - Smart Integrated Electronic Systems
R. Liske
- Fonction : Auteur
Raphael Ramos
- Fonction : Auteur
- PersonId : 854590
- IdHAL : raphramos
- ORCID : 0000-0003-0627-6959
Koenemann Fabien
- Fonction : Auteur
Bingam Cheng
- Fonction : Auteur
Rongmei Chen
- Fonction : Auteur
- PersonId : 1032245
- ORCID : 0000-0003-3613-7626
Aida Todri-Sanial
- Fonction : Auteur
- PersonId : 6348
- IdHAL : todri
- ORCID : 0000-0001-8573-2910
- IdRef : 235598879
Résumé
Here, we review and present current challenges and progress on Carbon Nanotube Integration for BEOL Interconnects as well as our recent results. Amongst all the research on carbon nanotube interconnects, those discussed here cover 1) improvement of the variability of SWCNTs for local interconnects 2) process & growth of carbon nanotube interconnects compatible with BEOL integration and formation of CNT-copper-composites, 3) modeling and simulation from atomistic to circuit-level benchmarking and performance prediction, and 4) characterization and electrical measurements. The aim is to evaluate the use of CNT-based materials for future metallization, both in regards to manufacturability, i.e. CMOS compatibility and wafer-scale integration as well as realistic performance expectations, i.e. variability and defectivity.