Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects - LIRMM - Laboratoire d’Informatique, de Robotique et de Microélectronique de Montpellier Access content directly
Conference Papers Year : 2018

Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects

R. Liske
  • Function : Author
Salvatore Amoroso
  • Function : Author
Liping Wang
  • Function : Author
Koenemann Fabien
  • Function : Author
Goncalo Goncalves
  • Function : Author
Bingam Cheng
  • Function : Author
Jie Liang
  • Function : Author
  • PersonId : 971767
Reetu Raj Pandey
  • Function : Author
  • PersonId : 1032244
Rongmei Chen
Aida Todri-Sanial

Abstract

Here, we review and present current challenges and progress on Carbon Nanotube Integration for BEOL Interconnects as well as our recent results. Amongst all the research on carbon nanotube interconnects, those discussed here cover 1) improvement of the variability of SWCNTs for local interconnects 2) process & growth of carbon nanotube interconnects compatible with BEOL integration and formation of CNT-copper-composites, 3) modeling and simulation from atomistic to circuit-level benchmarking and performance prediction, and 4) characterization and electrical measurements. The aim is to evaluate the use of CNT-based materials for future metallization, both in regards to manufacturability, i.e. CMOS compatibility and wafer-scale integration as well as realistic performance expectations, i.e. variability and defectivity.

Dates and versions

lirmm-01880138 , version 1 (24-09-2018)

Identifiers

Cite

Benjamin Uhlig, Abitha Dhavamani, Nicole Nagy, Katharina Lilienthal, R. Liske, et al.. Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects. IITC: International Interconnect Technology Conference, Jun 2018, Santa Clara, United States. pp.16-18, ⟨10.1109/IITC.2018.8430411⟩. ⟨lirmm-01880138⟩
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