Power-Supply Noise Analysis for Monolithic 3D ICs Using Electrical and Thermal Co-Simulation - LIRMM - Laboratoire d’Informatique, de Robotique et de Microélectronique de Montpellier Access content directly
Conference Papers Year : 2019

Power-Supply Noise Analysis for Monolithic 3D ICs Using Electrical and Thermal Co-Simulation

Abstract

Reliable power-delivery network (PDN) design is a major challenge for monolithic 3D (M3D) ICs due to higher power density and current demand per unit area, higher parasitics of interconnects, lower supply voltage, and faster clock. As a first step towards the development of design solutions, we carry out power-supply noise analysis for M3D ICs using electrical and thermal co-simulation. We study the power-supply noise for different PDN designs and analyze design features that impact power-supply noise. This study of power-supply noise motivates further studies on reliable power delivery for M3D ICs.
No file

Dates and versions

lirmm-01880158 , version 1 (24-09-2018)

Identifiers

Cite

Abhishek Koneru, Aida Todri-Sanial, Krishnendu Chakrabarty. Power-Supply Noise Analysis for Monolithic 3D ICs Using Electrical and Thermal Co-Simulation. 25th IEEE International Conference on Electronics Circuits and Systems (ICECS 2018), Dec 2018, Bordeaux, France. pp.217-220, ⟨10.1109/ICECS.2018.8617951⟩. ⟨lirmm-01880158⟩
187 View
0 Download

Altmetric

Share

Gmail Facebook X LinkedIn More