Power-Supply Noise Analysis for Monolithic 3D ICs Using Electrical and Thermal Co-Simulation

Abstract : Reliable power-delivery network (PDN) design is a major challenge for monolithic 3D (M3D) ICs due to higher power density and current demand per unit area, higher parasitics of interconnects, lower supply voltage, and faster clock. As a first step towards the development of design solutions, we carry out power-supply noise analysis for M3D ICs using electrical and thermal co-simulation. We study the power-supply noise for different PDN designs and analyze design features that impact power-supply noise. This study of power-supply noise motivates further studies on reliable power delivery for M3D ICs.
Type de document :
Communication dans un congrès
ICECS: International Conference on Electronics Circuits and Systems, Dec 2018, Bordeaux, France. 25th IEEE International Conference on Electronics Circuits and Systems, 2018, 〈https://www.ieee-icecs2018.org〉
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https://hal-lirmm.ccsd.cnrs.fr/lirmm-01880158
Contributeur : Aida Todri-Sanial <>
Soumis le : lundi 24 septembre 2018 - 15:17:21
Dernière modification le : jeudi 27 septembre 2018 - 01:19:28

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  • HAL Id : lirmm-01880158, version 1

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Abhishek Koneru, Aida Todri-Sanial, Krishnendu Chakrabarty. Power-Supply Noise Analysis for Monolithic 3D ICs Using Electrical and Thermal Co-Simulation. ICECS: International Conference on Electronics Circuits and Systems, Dec 2018, Bordeaux, France. 25th IEEE International Conference on Electronics Circuits and Systems, 2018, 〈https://www.ieee-icecs2018.org〉. 〈lirmm-01880158〉

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