Skip to Main content Skip to Navigation
Conference papers

Power-Supply Noise Analysis for Monolithic 3D ICs Using Electrical and Thermal Co-Simulation

Abstract : Reliable power-delivery network (PDN) design is a major challenge for monolithic 3D (M3D) ICs due to higher power density and current demand per unit area, higher parasitics of interconnects, lower supply voltage, and faster clock. As a first step towards the development of design solutions, we carry out power-supply noise analysis for M3D ICs using electrical and thermal co-simulation. We study the power-supply noise for different PDN designs and analyze design features that impact power-supply noise. This study of power-supply noise motivates further studies on reliable power delivery for M3D ICs.
Complete list of metadata

https://hal-lirmm.ccsd.cnrs.fr/lirmm-01880158
Contributor : Aida Todri-Sanial <>
Submitted on : Monday, September 24, 2018 - 3:17:21 PM
Last modification on : Friday, February 5, 2021 - 6:43:35 PM

Identifiers

Citation

Abhishek Koneru, Aida Todri-Sanial, Krishnendu Chakrabarty. Power-Supply Noise Analysis for Monolithic 3D ICs Using Electrical and Thermal Co-Simulation. 25th IEEE International Conference on Electronics Circuits and Systems (ICECS 2018), Dec 2018, Bordeaux, France. pp.217-220, ⟨10.1109/ICECS.2018.8617951⟩. ⟨lirmm-01880158⟩

Share

Metrics

Record views

271