Testing System-In-Package Wirelessly

Abstract : The paper shows a new concept for testing a systemin- package (SiP) using a wireless communication. Trends of the SiP technology put more economic and technical constraints onto the test, while the contactless test techniques represent an opportunity to overcome the inherent problems. In this paper, we introduce a new test concept based on a wireless communication, a specific test access mechanism (TAM), and an optimised architecture. Although this approach is dedicated to an intermediate test of SiP, we explore other potential applications of this technology.
Type de document :
Communication dans un congrès
IEEE. DTIS: Design and Technology of Integrated Systems in Nanoscale Era, Sep 2006, Tunis, Tunisia. Design and Technology of Integrated Systems in Nanoscale Era, pp.222-226, 2006
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Soumis le : vendredi 15 septembre 2006 - 10:29:02
Dernière modification le : jeudi 11 janvier 2018 - 06:27:19
Document(s) archivé(s) le : mardi 6 avril 2010 - 00:58:31

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  • HAL Id : lirmm-00094916, version 1

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Serge Bernard, David Andreu, Marie-Lise Flottes, Philippe Cauvet, Hervé Fleury, et al.. Testing System-In-Package Wirelessly. IEEE. DTIS: Design and Technology of Integrated Systems in Nanoscale Era, Sep 2006, Tunis, Tunisia. Design and Technology of Integrated Systems in Nanoscale Era, pp.222-226, 2006. 〈lirmm-00094916〉

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