Comparison of the Benefits, From SiO2 to Ultralow-K Dielectric and Air Spacing Introduction, in Term of Interconnects Performances, for the Future High Speed Ic's in a Multicoupled Lines System

Type de document :
Communication dans un congrès
11th IEEE Workshop on Signal Propagation on Interconnects, May 2007, Genova, Italy. IEEE, pp.24-28, 2007
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https://hal-lirmm.ccsd.cnrs.fr/lirmm-00148905
Contributeur : Martine Peridier <>
Soumis le : mercredi 23 mai 2007 - 16:38:45
Dernière modification le : jeudi 24 mai 2018 - 15:59:24

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  • HAL Id : lirmm-00148905, version 1

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Freddy Ponchel, Jean-François Legier, Erick Paleczny, Christophe Seguinot, Denis Deschacht. Comparison of the Benefits, From SiO2 to Ultralow-K Dielectric and Air Spacing Introduction, in Term of Interconnects Performances, for the Future High Speed Ic's in a Multicoupled Lines System. 11th IEEE Workshop on Signal Propagation on Interconnects, May 2007, Genova, Italy. IEEE, pp.24-28, 2007. 〈lirmm-00148905〉

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