Freddy Ponchel, Jean-François Legier, Erick Paleczny, Christophe Seguinot, Denis Deschacht. Comparison of the Benefits, From SiO2 to Ultralow-K Dielectric and Air Spacing Introduction, in Term of Interconnects Performances, for the Future High Speed Ic's in a Multicoupled Lines System.
11th IEEE Workshop on Signal Propagation on Interconnects, May 2007, Genova, Italy. IEEE, pp.24-28, 2007.
〈lirmm-00148905〉 
