System-in-Package, a Combination of Challenges and Solutions - LIRMM - Laboratoire d’Informatique, de Robotique et de Microélectronique de Montpellier Access content directly
Conference Papers Year : 2007

System-in-Package, a Combination of Challenges and Solutions

Philippe Cauvet
  • Function : Author
NXP Semiconductors
Serge Bernard
Conception et Test de Systèmes MICroélectroniques
CV
Michel Renovell
Conception et Test de Systèmes MICroélectroniques
CV

Domains

Micro and nanotechnologies/Microelectronics

Martine Peridier  : Connect in order to contact the contributor

https://hal-lirmm.ccsd.cnrs.fr/lirmm-00158123

Submitted on : Thursday, June 28, 2007-10:15:24 AM

Last modification on : Friday, March 24, 2023-2:52:49 PM

No file

Dates and versions

lirmm-00158123 , version 1 (28-06-2007)

Identifiers

  • HAL Id : lirmm-00158123 , version 1

Cite

Philippe Cauvet, Serge Bernard, Michel Renovell. System-in-Package, a Combination of Challenges and Solutions. ETS: European Test Symposium, May 2007, Freiburg, Germany. pp.193-199. ⟨lirmm-00158123⟩

Export

BibTeX XML-TEI Dublin Core DC Terms EndNote DataCite

Collections

CNRS SYSMIC LIRMM LIRMM_MIC MIC MIPS UNIV-MONTPELLIER
109 View
0 Download

Share

Gmail Mastodon Facebook X LinkedIn More