Sensor Testing Through Bias Superposition - LIRMM - Laboratoire d’Informatique, de Robotique et de Microélectronique de Montpellier
Article Dans Une Revue Sensors and Actuators A: Physical Année : 2007

Sensor Testing Through Bias Superposition

Résumé

A novel on-line monitoring technique for integrated MEMS is presented based on injection of an electrical test stimulus into the bias structure through both superposition or modulation. The techniques “bias superposition and bias modulation” both support integrated structural test that targets both production test and on-line condition monitoring through generation of dependability metric. It can in some cases be used to provide the raw data for on-line calibration and compensation. The techniques are demonstrated on three integrated MEMS structures from the field of consumer electronics, aerospace and environmental sensing and have been successfully applied to a thick film conductance sensor.

Dates et versions

lirmm-00177756 , version 1 (09-10-2007)

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Citer

Carl Jeffrey, Norbert Dumas, Zhou Xu, Frédérick Mailly, Florence Azaïs, et al.. Sensor Testing Through Bias Superposition. Sensors and Actuators A: Physical , 2007, 136 (1), pp.441-455. ⟨10.1016/j.sna.2006.11.030⟩. ⟨lirmm-00177756⟩
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