Wireless Test Structure for Integrated Systems

Abstract : Contact-based wafer testing of complex integrated systems presents several drawbacks: inherent limitations in terms of pad pitch reduction and number of devices tested in parallel, eventual "touchdown" damage to the chip when recursive test is required. This paper presents a solution based on a wireless communication between the test equipment and the device under test.
Type de document :
Poster
ITC'2008: International Test Conference, Oct 2008, Santa Clara, CA, United States. pp.N/A, 2008, 〈10.1109/TEST.2008.4700704〉
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https://hal-lirmm.ccsd.cnrs.fr/lirmm-00375077
Contributeur : Martine Peridier <>
Soumis le : lundi 13 avril 2009 - 10:23:52
Dernière modification le : jeudi 24 mai 2018 - 15:59:24

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Ziad Noun, Philippe Cauvet, Marie-Lise Flottes, David Andreu, Serge Bernard. Wireless Test Structure for Integrated Systems. ITC'2008: International Test Conference, Oct 2008, Santa Clara, CA, United States. pp.N/A, 2008, 〈10.1109/TEST.2008.4700704〉. 〈lirmm-00375077〉

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