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Conference Poster Year : 2008

Wireless Test Structure for Integrated Systems

Abstract

Contact-based wafer testing of complex integrated systems presents several drawbacks: inherent limitations in terms of pad pitch reduction and number of devices tested in parallel, eventual "touchdown" damage to the chip when recursive test is required. This paper presents a solution based on a wireless communication between the test equipment and the device under test.
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lirmm-00375077 , version 1 (13-04-2009)

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Ziad Noun, Philippe Cauvet, Marie-Lise Flottes, David Andreu, Serge Bernard. Wireless Test Structure for Integrated Systems. ITC'2008: International Test Conference, Oct 2008, Santa Clara, CA, United States. pp.N/A, 2008, ⟨10.1109/TEST.2008.4700704⟩. ⟨lirmm-00375077⟩
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