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Wireless Test Structure for Integrated Systems

Abstract : Contact-based wafer testing of complex integrated systems presents several drawbacks: inherent limitations in terms of pad pitch reduction and number of devices tested in parallel, eventual "touchdown" damage to the chip when recursive test is required. This paper presents a solution based on a wireless communication between the test equipment and the device under test.
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Submitted on : Monday, April 13, 2009 - 10:23:52 AM
Last modification on : Friday, August 5, 2022 - 10:48:00 AM




Ziad Noun, Philippe Cauvet, Marie-Lise Flottes, David Andreu, Serge Bernard. Wireless Test Structure for Integrated Systems. ITC'2008: International Test Conference, Oct 2008, Santa Clara, CA, United States. pp.N/A, 2008, ⟨10.1109/TEST.2008.4700704⟩. ⟨lirmm-00375077⟩



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