This paper presents a behavioral model that can be used to improve the manufacturability of systems based on MEMS convective sensors. This model permits to handle faults related to process scattering, taking into account not only the electrical and lateral geometrical parameters but also the influence of the cavity depth. Moreover correlations between conductive and convective phenomena are included. The model is validated with respect to FEM simulations and a very good agreement is obtained between the behavioral model and FEM results. The proposed model can then be used in system-level simulations, for instance to evaluate the impact of process scattering on the performances of the sensing part and/or to investigate different design and calibration strategies with respect to the system robustness.