Resistive Open Defect Analysis for Through-Silicon-Vias - LIRMM - Laboratoire d’Informatique, de Robotique et de Microélectronique de Montpellier Access content directly
Conference Poster Year : 2012

Resistive Open Defect Analysis for Through-Silicon-Vias

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Micro and nanotechnologies/Microelectronics

Arnaud Virazel  : Connect in order to contact the contributor

https://hal-lirmm.ccsd.cnrs.fr/lirmm-00806795

Submitted on : Tuesday, April 2, 2013-1:20:45 PM

Last modification on : Friday, March 24, 2023-2:52:57 PM

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lirmm-00806795 , version 1 (02-04-2013)

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  • HAL Id : lirmm-00806795 , version 1

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Carolina Momo Metzler, Aida Todri-Sanial, Arnaud Virazel, Alberto Bosio, Luigi Dilillo, et al.. Resistive Open Defect Analysis for Through-Silicon-Vias. ETS: European Test Symposium, May 2012, Annecy, France. 17th IEEE European Test Symposium, pp.183, 2012. ⟨lirmm-00806795⟩

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