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Poster communications

Resistive Open Defect Analysis for Through-Silicon-Vias

Carolina Momo Metzler 1 Aida Todri-Sanial 2 Arnaud Virazel 2 Alberto Bosio 2 Luigi Dilillo 2 Patrick Girard 2 
1 LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
2 SysMIC - Conception et Test de Systèmes MICroélectroniques
LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
Document type :
Poster communications
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https://hal-lirmm.ccsd.cnrs.fr/lirmm-00806795
Contributor : Arnaud Virazel Connect in order to contact the contributor
Submitted on : Tuesday, April 2, 2013 - 1:20:45 PM
Last modification on : Friday, August 5, 2022 - 10:48:15 AM

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  • HAL Id : lirmm-00806795, version 1

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CNRS | SYSMIC | LIRMM | LIRMM_MIC | MIC | MIPS | UNIV-MONTPELLIER

Citation

Carolina Momo Metzler, Aida Todri-Sanial, Arnaud Virazel, Alberto Bosio, Luigi Dilillo, et al.. Resistive Open Defect Analysis for Through-Silicon-Vias. ETS: European Test Symposium, May 2012, Annecy, France. 17th IEEE European Test Symposium, pp.183, 2012. ⟨lirmm-00806795⟩

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