Resistive Open Defect Analysis for Through-Silicon-Vias - LIRMM - Laboratoire d’Informatique, de Robotique et de Microélectronique de Montpellier Access content directly
Conference Poster Year : 2012
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lirmm-00806795 , version 1 (02-04-2013)

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  • HAL Id : lirmm-00806795 , version 1

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Carolina Momo Metzler, Aida Todri-Sanial, Arnaud Virazel, Alberto Bosio, Luigi Dilillo, et al.. Resistive Open Defect Analysis for Through-Silicon-Vias. ETS: European Test Symposium, May 2012, Annecy, France. 17th IEEE European Test Symposium, pp.183, 2012. ⟨lirmm-00806795⟩
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