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Poster communications

Resistive Open Defect Analysis for Through-Silicon-Vias

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Poster communications
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https://hal-lirmm.ccsd.cnrs.fr/lirmm-00806795
Contributor : Arnaud Virazel <>
Submitted on : Tuesday, April 2, 2013 - 1:20:45 PM
Last modification on : Wednesday, December 11, 2019 - 1:32:02 AM

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  • HAL Id : lirmm-00806795, version 1

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Carolina Momo Metzler, Aida Todri-Sanial, Arnaud Virazel, Alberto Bosio, Luigi Dilillo, et al.. Resistive Open Defect Analysis for Through-Silicon-Vias. ETS: European Test Symposium, May 2012, Annecy, France. 17th IEEE European Test Symposium, pp.183, 2012. ⟨lirmm-00806795⟩

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