A new monolithic 3-axis thermal convective accelerometer: principle, design, fabrication and characterization

Huy Binh Nguyen 1 Frédérick Mailly 1 Laurent Latorre 1 Pascal Nouet 1
1 SysMIC - Conception et Test de Systèmes MICroélectroniques
LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
Abstract : Thermal convective accelerometers are based on heat transfer in a fluid-filled cavity. Working principle of these sensors is well known and first MEMS implementations were reported in the late 90’s. Since that time, many single-axis or dual-axis sensors were reported. Therefore, complex assembly operations were needed to implement 3-axis acceleration measurement using two dies or more. The goal of this paper is then to demonstrate out-of-plane sensitivity of a 2-axis thermal convective accelerometer and to present extensively the first monolithic MEMS device allowing acceleration measurements in three orthogonal directions. First, finite element modeling is used to study the impact of geometrical parameters and heating power on sensor performances. Second, a prototype has been designed to prove feasibility of a fully integrated 3-axis sensor obtained by a self-aligned post-CMOS etching of a silicon die. To our knowledge, the presented device is the first 3-axis MEMS sensor manufactured in a standard CMOS technology ever reported in the literature.
Keywords : Accelerometer MEMS Thermal accelerometer Thermal sensor
Type de document :
Article dans une revue
Microsystem Technologies, Springer Verlag, 2015, 21 (9), pp.1867-1877. 〈10.1007/s00542-014-2254-0〉
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https://hal-lirmm.ccsd.cnrs.fr/lirmm-01166797
Contributeur : Frédérick Mailly <>
Soumis le : mardi 23 juin 2015 - 11:20:32
Dernière modification le : jeudi 11 janvier 2018 - 06:27:19

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SYSMIC | LIRMM | LIRMM_MIC | MIC | MIPS | UNIV-MONTPELLIER

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Huy Binh Nguyen, Frédérick Mailly, Laurent Latorre, Pascal Nouet. A new monolithic 3-axis thermal convective accelerometer: principle, design, fabrication and characterization. Microsystem Technologies, Springer Verlag, 2015, 21 (9), pp.1867-1877. 〈10.1007/s00542-014-2254-0〉. 〈lirmm-01166797〉

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