On the Performance Exploration of 3D NoCs with Resistive-Open TSVs

Abstract : Three-dimensional Networks-on-Chip (3D NoCs) are based on Through-Silicon-Vias (TSV), which offer several advantages such as stacking, high throughput and energy efficiency. However, TSVs suffer from design process variations. On the other hand, designing purely asynchronous serializers enables reliable inter-tier communication with moderate performance overhead. A side benefit lies in the intrinsic delay insensitivity of asynchronous logic which exploits serialized TSV links to their full timing potential, thereby mitigating process variability impact. This paper explores similar impact on 3D NoCs. It considers randomly generated process variation maps for which the impact on performance is analyzed according to various design parameters, e.g. TSV probabilistic delay distributions, TSV size and serialization rate.
Type de document :
Communication dans un congrès
ISVLSI: International Symposium on Very Large Scale Integration, Jul 2015, Montpellier, France. pp.579-584, 2015, Proceedings of the 2015 IEEE Computer Society Annual Symposium on VLSI (ISVLSI). 〈10.1109/ISVLSI.2015.49〉
Liste complète des métadonnées

https://hal-lirmm.ccsd.cnrs.fr/lirmm-01248588
Contributeur : Aida Todri-Sanial <>
Soumis le : dimanche 27 décembre 2015 - 21:41:21
Dernière modification le : mercredi 10 octobre 2018 - 13:52:39

Identifiants

Citation

Charles Effiong, Vianney Lapotre, Abdoulaye Gamatié, Gilles Sassatelli, Aida Todri-Sanial, et al.. On the Performance Exploration of 3D NoCs with Resistive-Open TSVs. ISVLSI: International Symposium on Very Large Scale Integration, Jul 2015, Montpellier, France. pp.579-584, 2015, Proceedings of the 2015 IEEE Computer Society Annual Symposium on VLSI (ISVLSI). 〈10.1109/ISVLSI.2015.49〉. 〈lirmm-01248588〉

Partager

Métriques

Consultations de la notice

735