Power supply noise-aware workload assignments for homogeneous 3D MPSoCs with thermal consideration

Yuanqing Cheng 1 Aida Todri-Sanial 1 Alberto Bosio 2 Luigi Dilillo 2 Patrick Girard 2 Arnaud Virazel 2
1 SmartIES - Smart Integrated Electronic Systems
LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
2 TEST
LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
Abstract : In order to improve performance and reduce cost, multi-processor system on chip (MPSoC) is increasingly becoming attractive. At the same time, 3D integration emerges as a promising technology for high density integration. 3D homogeneous MPSoCs combine the benefits of both. However, high current demand and large on-chip switching activity variations introduce severe power supply noises (PSN) for 3D MPSoCs, which can increase critical path delay, and degrade chip performance and reliability. Meanwhile, thermal gradient should also be considered for 3D MPSoCs to avoid hot spots. In the paper, we investigate the PSN effects of different workloads and propose an effective PSN estimation method. Then, a heuristic workload assignment algorithm is proposed to suppress PSN under the given thermal constraint. The experimental results show that PSNs can be reduced significantly compared with thermal-balanced workload assignment scheme, and the system performance can be improved as well.
Type de document :
Communication dans un congrès
ASP-DAC: Asia and South Pacific Design Automation Conference, Jan 2014, Singapore, Singapore. 19th Asia and South Pacific Design Automation Conference, pp.544-549, 2014, 〈10.1109/ASPDAC.2014.6742948〉
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https://hal-lirmm.ccsd.cnrs.fr/lirmm-01248596
Contributeur : Aida Todri-Sanial <>
Soumis le : dimanche 27 décembre 2015 - 21:41:31
Dernière modification le : vendredi 22 mars 2019 - 15:12:02

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Yuanqing Cheng, Aida Todri-Sanial, Alberto Bosio, Luigi Dilillo, Patrick Girard, et al.. Power supply noise-aware workload assignments for homogeneous 3D MPSoCs with thermal consideration. ASP-DAC: Asia and South Pacific Design Automation Conference, Jan 2014, Singapore, Singapore. 19th Asia and South Pacific Design Automation Conference, pp.544-549, 2014, 〈10.1109/ASPDAC.2014.6742948〉. 〈lirmm-01248596〉

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