In this paper, we analyse the impact of voltage, temperature and body-biasing on the detection of resistive short defects for low-VT (LVT) and regular-VT (RVT) configurations of a 28nm UTBB FDSOI (Ultra-Thin Body & BOX Fully-Depleted Silicon-on-Insulator) technology. We implemented a similar design in each configuration and compared their electrical behaviors with the same resistive short defect. In addition, this work focuses on determining the individual as well as the combined improvements brought by voltage, temperature and body-biasing settings for achieving the maximum coverage of the resistive short defects.