Carbon nanotube interconnects for energy-efficient integrated circuits

Aida Todri-Sanial 1
1 SysMIC - Conception et Test de Systèmes MICroélectroniques
LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
Abstract : Carbon nanotubes (CNTs) due their unique mechanical, thermal, and electrical properties are being investigated as promising candidate material for on-chip and off-chip interconnects. The attractive mechanical properties of CNTs,includes high Youngs modulus, resiliency and low thermal expansion coefficient offer great advantage for reliable and strong interconnects, and even more so for 3D integration. Through-Silicon-Vias (TSVs) enable 3D integration and implementationof denser, faster and heterogeneous circuits, which also lead to excessive power densities and elevated temperatures. Due to their unique properties, CNTs present an opportunity to address these challenges and provide solutions for reliable 3D integration. In this work, we perform detailed analyses of horizontally aligned CNTs and report on their efficiency to be exploited for 3D power delivery networks
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Communication dans un congrès
TNT: Trends in Nanotechnology, Sep 2015, Toulouse, France. 16th International Conference on Trends in Nanotechnology (TNT2015), 2015
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  • HAL Id : lirmm-01446233, version 1

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Aida Todri-Sanial. Carbon nanotube interconnects for energy-efficient integrated circuits. TNT: Trends in Nanotechnology, Sep 2015, Toulouse, France. 16th International Conference on Trends in Nanotechnology (TNT2015), 2015. 〈lirmm-01446233〉

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