Present and future prospects of carbon nanotube interconnects for energy efficient integrated circuits

Abstract : Carbon nanotubes (CNTs) due to their unique mechanical, thermal and electrical properties are being investigated as promising candidate material for on-chip and off-chip interconnects. The attractive mechanical properties of CNTs, including high Youngs modulus, resiliency and low thermal expansion coefficient offer great advantage for reliable and strong interconnects, and even more so for on-chip and off-chip integration. High bandwidth interconnects are required for achieving denser, faster and energy-efficient circuits. Due to their unique properties, CNTs present an opportunity to address the current challenges of copper interconnects and provide solutions for reliable efficient and smart system integration. In this work, we give an overview on the current advancements on CNT interconnects and the future prospects for energy efficient integration.
Type de document :
Communication dans un congrès
EuroSimE: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2016, Montpellier, France. 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2016, 〈https://www.eurosime.org/b16.htm〉. 〈10.1109/EuroSimE.2016.7463379〉
Liste complète des métadonnées

Littérature citée [41 références]  Voir  Masquer  Télécharger

https://hal-lirmm.ccsd.cnrs.fr/lirmm-01446241
Contributeur : Caroline Lebrun <>
Soumis le : mercredi 25 janvier 2017 - 16:43:07
Dernière modification le : jeudi 11 janvier 2018 - 06:27:19
Document(s) archivé(s) le : mercredi 26 avril 2017 - 15:35:25

Fichier

EUROSIME16.pdf
Fichiers éditeurs autorisés sur une archive ouverte

Identifiants

Collections

Citation

Aida Todri-Sanial, Alessandro Magnani, Massimiliano De Magistris, Antonio Maffucci. Present and future prospects of carbon nanotube interconnects for energy efficient integrated circuits. EuroSimE: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2016, Montpellier, France. 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2016, 〈https://www.eurosime.org/b16.htm〉. 〈10.1109/EuroSimE.2016.7463379〉. 〈lirmm-01446241〉

Partager

Métriques

Consultations de la notice

185

Téléchargements de fichiers

220