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Thermal issues in test: An overview of the significant aspects and industrial practice

Juergen Alt 1 Paolo Bernardi 2 Alberto Bosio 3 Ricardo Cantoro 4 Hans Kerkhoff 5 Andreas Leininger 1 Wolfgang Molzer 1 Allessandro Motta 6 Christian Pacha 1 Alberto Pagani 6 Alireza Rohani 5 Rudolf Strasser 1
1 INTEL [Germany]
2 DET - Dipartimento di Elettronica e Telecomunicazioni [Turin]
3 SysMIC - Conception et Test de Systèmes MICroélectroniques
LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
4 Polito - Politecnico di Torino [Torino]
5 University of Twente [Netherlands]
6 ST-AGRATE - STMicroelectronics [Agrate Brianza]
Abstract : Thermal phenomena occurring along test execution at the final stages of the manufacturing flow are considered as a significant issue for several reasons, including dramatic effects like circuit damage that is leading to yield loss. This paper tries to redeem those bad guys in order to exploit them to improve the test quality, reducing the overall test cost without affecting the yield.
Keywords : Very large scale integration Switches Temperature measurement Temperature distribution Estimation Thermal resistance
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https://hal-lirmm.ccsd.cnrs.fr/lirmm-01447125
Contributor : Caroline Lebrun <>
Submitted on : Thursday, January 26, 2017 - 3:55:35 PM
Last modification on : Friday, March 22, 2019 - 3:12:02 PM

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LIRMM | CNRS | SYSMIC | LIRMM_MIC | MIC | MIPS | UNIV-MONTPELLIER | TEST

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Juergen Alt, Paolo Bernardi, Alberto Bosio, Ricardo Cantoro, Hans Kerkhoff, et al.. Thermal issues in test: An overview of the significant aspects and industrial practice. VTS: VLSI Test Symposium, Apr 2016, Las Vegas, NV, United States. ⟨10.1109/VTS.2016.7477278⟩. ⟨lirmm-01447125⟩

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