Thermal issues in test: An overview of the significant aspects and industrial practice

Abstract : Thermal phenomena occurring along test execution at the final stages of the manufacturing flow are considered as a significant issue for several reasons, including dramatic effects like circuit damage that is leading to yield loss. This paper tries to redeem those bad guys in order to exploit them to improve the test quality, reducing the overall test cost without affecting the yield.
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https://hal-lirmm.ccsd.cnrs.fr/lirmm-01447125
Contributor : Caroline Lebrun <>
Submitted on : Thursday, January 26, 2017 - 3:55:35 PM
Last modification on : Friday, March 22, 2019 - 3:12:02 PM

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Juergen Alt, Paolo Bernardi, Alberto Bosio, Ricardo Cantoro, Hans Kerkhoff, et al.. Thermal issues in test: An overview of the significant aspects and industrial practice. VTS: VLSI Test Symposium, Apr 2016, Las Vegas, NV, United States. ⟨10.1109/VTS.2016.7477278⟩. ⟨lirmm-01447125⟩

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