A Survey of Carbon Nanotube Interconnects for Energy Efficient Integrated Circuits - LIRMM - Laboratoire d’Informatique, de Robotique et de Microélectronique de Montpellier
Journal Articles IEEE Circuits and Systems Magazine -New Series- Year : 2017

A Survey of Carbon Nanotube Interconnects for Energy Efficient Integrated Circuits

Aida Todri-Sanial
Salvatore Amoroso
  • Function : Author
Andrew Pender
  • Function : Author
Andrew Brown
  • Function : Author
Campbell Millar
  • Function : Author
Jie Liang
  • Function : Author
  • PersonId : 971767
Goncalo Goncalves
  • Function : Author
  • PersonId : 879367
Nalin Rupesinghe
  • Function : Author
Ken Teo
  • Function : Author

Abstract

This article is a review of the state-of-art carbon nanotube interconnects for Silicon application with respect to the recent literature. Amongst all the research on carbon nanotube interconnects, those discussed here cover 1) challenges with current copper interconnects, 2) process & growth of carbon nanotube interconnects compatible with back-end-of-line integration, and 3) modeling and simulation for circuit-level benchmarking and performance prediction. The focus is on the evolution of carbon nanotube interconnects from the process, theoretical modeling, and experimental characterization to on-chip interconnect applications. We provide an overview of the current advancements on carbon nanotube interconnects and also regarding the prospects for designing energy efficient integrated circuits. Each selected category is presented in an accessible manner aiming to serve as a survey and informative cornerstone on carbon nanotube interconnects relevant to students and scientists belonging to a range of fields from physics, processing to circuit design.

Dates and versions

lirmm-01795757 , version 1 (18-05-2018)

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Aida Todri-Sanial, Raphael Ramos, Hanako Okuno, Jean Dijon, Abitha Dhavamani, et al.. A Survey of Carbon Nanotube Interconnects for Energy Efficient Integrated Circuits. IEEE Circuits and Systems Magazine -New Series-, 2017, 17 (2), pp.47-62. ⟨10.1109/MCAS.2017.2689538⟩. ⟨lirmm-01795757⟩
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