A Novel Low-Cost TMR-Without-Voter Based HIS-Insensitive and MNU-Tolerant Latch Design for Space Applications - LIRMM - Laboratoire d’Informatique, de Robotique et de Microélectronique de Montpellier Accéder directement au contenu
Article Dans Une Revue IEEE Transactions on Aerospace and Electronic Systems Année : 2020

A Novel Low-Cost TMR-Without-Voter Based HIS-Insensitive and MNU-Tolerant Latch Design for Space Applications

Aibin Yan
Kang Yang
Jie Cui
Xiaoqing Wen

Résumé

With complementary metal oxide semiconductor (CMOS) technology scaling down, radiation induced multiple-node upsets (MNUs) that include double-node-upsets and triple-node upsets (TNUs) are becoming more and more an issue in storage cells used for applications constrained by their environment, such as aerospace applications confronted to radiations. This article presents a novel triple-modular redundancy without voter based high-impedance state (HIS) insensitive and MNU-tolerant latch design, namely TMHIMNT, to ensure both high reliability and low cost. The TMHIMNT latch mainly comprises triple clock-gating (CG) based dual-interlocked-storage-cells (DICEs) and four inverters. Through three internal inverters, the values stored in DICEs converge to a common node feeding an output-level inverter, enabling the TMHIMNT latch to tolerate any possible MNU. Simulation results demonstrate the MNU tolerance of the proposed TMHIMNT latch. Due to the disuse of C-elements, the proposed TMHIMNT latch is insensitive to the HIS, making the latch more reliable for aerospace applications. Moreover, compared with the state-of-the-art TNU hardened latch, due to the use of a high-speed path, CG technologies, and fewer transistors, the proposed TMHIMNT latch can achieve 98% delay, 17% power, and 29% area reductions, respectively.
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lirmm-02395572 , version 1 (07-09-2022)

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Aibin Yan, Kang Yang, Jie Cui, Patrick Girard, Xiaoqing Wen. A Novel Low-Cost TMR-Without-Voter Based HIS-Insensitive and MNU-Tolerant Latch Design for Space Applications. IEEE Transactions on Aerospace and Electronic Systems, 2020, 56 (4), pp.2666-2676. ⟨10.1109/TAES.2019.2951186⟩. ⟨lirmm-02395572⟩
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