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Heterogeneous Integration Roadmap (HIR): Co-Design Challenges and Perspectives

Aida Todri-Sanial 1
1 SmartIES - Smart Integrated Electronic Systems
LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
Abstract : The heterogeneous integration roadmap (HIR) offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of emerging devices and materials with longer research-and-development timelines. In this talk, the aspects of co-design current state of the art, challenges and prospects are discussed. The need of cross-domain design tools for chip-package-pcb are highlighted. Also, the new design requirements for novel computing paradigms such as neuromorphic and quantum computing are discussed.
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Contributor : Aida Todri-Sanial <>
Submitted on : Wednesday, December 11, 2019 - 1:00:34 AM
Last modification on : Tuesday, December 17, 2019 - 2:26:46 AM


  • HAL Id : lirmm-02403741, version 1


Aida Todri-Sanial. Heterogeneous Integration Roadmap (HIR): Co-Design Challenges and Perspectives. 2019. ⟨lirmm-02403741⟩



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