Heterogeneous Integration Roadmap (HIR): Co-Design Challenges and Perspectives - LIRMM - Laboratoire d’Informatique, de Robotique et de Microélectronique de Montpellier Access content directly
Other Publications Year : 2019

Heterogeneous Integration Roadmap (HIR): Co-Design Challenges and Perspectives

Aida Todri-Sanial

Abstract

The heterogeneous integration roadmap (HIR) offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of emerging devices and materials with longer research-and-development timelines. In this talk, the aspects of co-design current state of the art, challenges and prospects are discussed. The need of cross-domain design tools for chip-package-pcb are highlighted. Also, the new design requirements for novel computing paradigms such as neuromorphic and quantum computing are discussed.
No file

Dates and versions

lirmm-02403741 , version 1 (11-12-2019)

Identifiers

  • HAL Id : lirmm-02403741 , version 1

Cite

Aida Todri-Sanial. Heterogeneous Integration Roadmap (HIR): Co-Design Challenges and Perspectives. 2019. ⟨lirmm-02403741⟩
90 View
0 Download

Share

Gmail Facebook X LinkedIn More