The heterogeneous integration roadmap (HIR) offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of emerging devices and materials with longer research-and-development timelines. In this talk, the aspects of co-design current state of the art, challenges and prospects are discussed. The need of cross-domain design tools for chip-package-pcb are highlighted. Also, the new design requirements for novel computing paradigms such as neuromorphic and quantum computing are discussed.