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Conference papers

Exploring flexible and 3D printing technologies for the design of high spatial resolution EM probes

Julien Toulemont 1 Frédérick Mailly 1 Philippe Maurine 1 Pascal Nouet 1
1 SmartIES - Smart Integrated Electronic Systems
LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
Abstract : Electromagnetic analysis of the field radiated by ICs is a common practice in the field of hardware security, especially for reverse engineering or to disclose cryptographic keys. While surprisingly the scaling of CMOS technologies carries on, it is important to scale down the sensors used to perform such analyses. Within this context, this paper explores the potential of flexible and 3D printing technologies to design low cost, electrically and mechanically robust electromagnetic probes with spatial resolution about 50µm while the standard is currently about 100µm.
Keywords : Side channel attacks Electromagnetic side channel Sensor Hardware security
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Conference papers
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https://hal-lirmm.ccsd.cnrs.fr/lirmm-03278789
Contributor : Philippe Maurine Connect in order to contact the contributor
Submitted on : Monday, July 5, 2021 - 11:04:21 PM
Last modification on : Saturday, April 2, 2022 - 3:38:26 AM

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LIRMM | LIRMM_MIC | MIC | MIPS | UNIV-MONTPELLIER | SMARTIES | CNRS | AXESECULIRMM

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Julien Toulemont, Frédérick Mailly, Philippe Maurine, Pascal Nouet. Exploring flexible and 3D printing technologies for the design of high spatial resolution EM probes. NEWCAS 2021 - 19th IEEE International New Circuits and Systems Conference, Jun 2021, Toulon, France. pp.1-4, ⟨10.1109/NEWCAS50681.2021.9462763⟩. ⟨lirmm-03278789⟩

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