Additivity of Capacitive and Inductive Coupling in Submicronic Interconnects

Jean-Etienne Lorival 1 Denis Deschacht 2 Yves Quéré 3, 4 Thierry Le Gouguec 3, 4 Fabrice Huret 3, 4
1 LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
2 SysMIC - Conception et Test de Systèmes MICroélectroniques
LIRMM - Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier
3 LEST - Laboratoire d'Electronique et Systèmes de Télécommunications
4 Lab-STICC - Laboratoire des sciences et techniques de l'information, de la communication et de la connaissance (UMR 3192)
Abstract : Constant evolution in integrated circuit technology has led to an increase in the switching speed of the digital chip. As a result, there is a growing interest in the inductance associated with signal lines. Inductive coupling effects on interconnects is an emerging concern in high performance digital integrated circuits. Based on an RLC transmission line model, associated to each propagation mode, a new crosstalk noise model is proposed to evaluate both the capacitive and the inductive coupling. The additivity of the coupling is shown and validated with several simulations.
Type de document :
Communication dans un congrès
IEEE. DTIS: Design and Technology of Integrated Systems in Nanoscale Era, Sep 2006, Tunis, Tunisia. Design and Technology of Integrated Systems in Nanoscale Era, pp.300-304, 2006
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Soumis le : mercredi 13 septembre 2006 - 11:38:16
Dernière modification le : jeudi 24 mai 2018 - 15:59:24
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Jean-Etienne Lorival, Denis Deschacht, Yves Quéré, Thierry Le Gouguec, Fabrice Huret. Additivity of Capacitive and Inductive Coupling in Submicronic Interconnects. IEEE. DTIS: Design and Technology of Integrated Systems in Nanoscale Era, Sep 2006, Tunis, Tunisia. Design and Technology of Integrated Systems in Nanoscale Era, pp.300-304, 2006. 〈lirmm-00093341〉

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